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NXP SPC5602DF1MLL3

Hersteller
Herst.-Teilenr.
SPC5602DF1MLL3
LCSC-Nr.
C1344882
Verp.
LQFP-100(14x14)
Kundennummer
Hauptmerkm.
Freescale Series 32 Bit 32MHz LQFP-100(14x14) Microcontrollers RoHS
DatenblattNXP SPC5602DF1MLL3
RoHS-Konformität2 Dokumente verfügbar
Alternativteile20
Garantie auf jede Bestellung
100% Authentisch · 30-Tage-Rückgabe oder -Umtausch
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Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 14.8079$ 14.81
200+$ 5.7313$ 1146.26
500+$ 5.5297$ 2764.85
1,000+$ 5.4305$ 5430.50
Standardgehäuse90/Full Tray
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Embedded/Microcontrollers
HerstellerNXP
Verp.LQFP-100(14x14)
ADC (Bit)12bit
Number of I/O79
Operating Temperature-40℃~+125℃
Voltage - Supply3V~5.5V
Program Memory TypeFLASH
EEPROM64KB
Program Storage Size256KB
CPU CoreFreescale Series
Core Size32 Bit
CPU Maximum Speed32MHz
Oscillator TypeBuilt-in

Beschreibung

KI-Übersetzung

This family of 32-bit system-on-chip (SoC) microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding fa

Merkmale

KI-Übersetzung
  • Single issue, 32-bit CPU core complex (e200z0h) Compliant with the Power Architecture technology embedded category
  • Enhanced instruction set allowing variable length encoding (VLE) for code size footprint reduction. With the optional encoding of mixed 16-bit and 32-bit instructions, it is possible to achieve significant code size footprint reduction
  • Up to 1.5 MB on-chip code flash memory supported with the flash memory controller
  • 64 (4×16) KB on-chip data flash memory with ECC
  • Up to 96 KB on-chip SRAM
  • Memory protection unit (MPU) with 8 region descriptors and 32-byte region granularity on certain family members
  • Interrupt controller (INTC) capable of handling 204 selectable-priority interrupt sources
  • Frequency modulated phase-locked loop (FMPLL)
  • Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters
  • 16-channel eDMA controller with multiple transfer request sources using DMA multiplexer
  • Boot assist module (BAM) supports internal Flash programming via a serial link (CAN or SCI)
  • Timer supports I/O channels providing a range of 16-bit input capture, output compare, and pulse width modulation functions (eMIOS)
  • 2 analog-to-digital converters (ADC): one 10-bit and one 12-bit
  • Cross Trigger Unit to enable synchronization of ADC conversions with a timer event from the eMIOS or PIT
  • Up to 6 serial peripheral interface (DSPI) modules
  • Up to 10 serial communication interface (LINFlex) modules
  • Up to 6 enhanced full CAN (FlexCAN) modules with configurable buffers
  • 1 inter-integrated circuit (I²C) interface module
  • Up to 149 configurable general purpose pins supporting input and output operations (package dependent)
  • Real-Time Counter (RTC)
  • Clock source from internal 128 kHz or 16 MHz oscillator supporting autonomous wakeup with 1 ms resolution with maximum timeout of 2 seconds
  • Optional support for RTC with clock source from external 32 kHz crystal oscillator, supporting wakeup with 1 sec resolution and maximum timeout of 1 hour
  • Up to 8 periodic interrupt timers (PIT) with 32-bit counter resolution
  • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 Class Two Plus
  • Device/board boundary scan testing supported per Joint Test Action Group (JTAG) of IEEE (IEEE 1149.1)
  • On-chip voltage regulator (VREG) for regulation of input supply for all internal levels

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