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TDK InvenSense ICM-20602 product image
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TDK InvenSense ICM-20602RoHS

Manufacturer
MPN
ICM-20602
LCSC Part #
C97633
Packaging
LGA-16(3x3)
Customer #
Key Attributes
6-Axis MEMS MotionTracking Device
Datasheetpdf iconTDK InvenSense ICM-20602

Products Specifications

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TypeDescription
CategorySensors, Transducers/Motion Sensors/IMUs (Inertial Measurement Units)
ManufacturerTDK InvenSense
PackagingLGA-16(3x3)
Accelerometer Sensing AxisX,Y,Z
Output Bits16bit
Cache Size1KB
FeaturesMotion event detection
Standby Current6uA
Acceleration Measurement Range (MAX)±16g

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging5000
Sales UnitPiece

Introduction

AI Translation

The ICM- 20602 is a 6- axis MotionTracking device that combines a 3- axis gyroscope, 3- axis accelerometer, in a small 3mm × 3mm × 0.75mm (16- pin LGA) package. High performance specs

  • Gyroscope sensitivity error: ± 1%
  • Gyroscope noise: ± 4mdps / √Hz
  • Accelerometer noise: 100μg / √Hz

Includes 1 KB FIFO to reduce traffic on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low- power mode

  • EIS FSYNC support

ICM- 20602 includes on- chip 16- bit ADCs, programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device features an operating voltage range down to 1.71V. Communication ports include I²C and high speed SPI at 10 MHz.

Features

AI Translation
  • 3- Axis Gyroscope with Programmable FSR of ± 250 dps, ± 500 dps, ± 1000 dps, and ± 2000 dps
  • 3- Axis Accelerometer with Programmable FSR of ± 2g, ± 4g, ± 8g, and ± 16g
  • User- programmable interrupts
  • Wake- on- motion interrupt for low power operation of applications processor
  • 1 KB FIFO buffer enables the applications processor to read the data in bursts
  • On- Chip 16- bit ADCs and Programmable Filters
  • Host interface: 10 MHz SPI or 400 kHz Fast Mode I²C
  • Digital- output temperature sensor
  • VDD operating range of 1.71V to 3.45V
  • MEMS structure hermetically sealed and bonded at wafer level
  • RoHS and Green compliant

Applications

AI Translation
  • Smartphones and Tablets
  • Wearable Sensors
  • IoT Applications
  • Motion- based game controllers
  • 3D remote controls for internet connected DTVs and set top boxes, 3D mice
In-Stock: 10,060
10,060 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 9.4551$ 9.46
10+$ 8.4822$ 84.82
30+$ 7.8887$ 236.66
100+$ 6.8088$ 680.88
Standard Packaging5000/Full Reel
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