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Infineon S25FS064SAGMFI013 product image
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Infineon S25FS064SAGMFI013

Manufacturer
MPN
S25FS064SAGMFI013
LCSC Part #
C7070328
Packaging
SOIC-8-208mil
Customer #
Key Attributes
64Mbit 1.7V~2V 133MHz SPI SOIC-8-208mil Memory RoHS
DatasheetInfineon S25FS064SAGMFI013
Alternative Parts10
Out of Stock
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QtyUnit Price(Reference Only)Total Amount
1+$ 5.5085$ 5.51
200+$ 2.1989$ 439.78
500+$ 2.1246$ 1062.30
1,000+$ 2.0883$ 2088.30
Standard Packaging2100/Full Reel
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerInfineon
PackagingSOIC-8-208mil
Operating Temperature-40℃~+85℃
FeaturesWrite enable latch;Power-on reset;Hardware write protection;Software write protection;Absolute write protection;ECC error correction
Memory Size64Mbit
Voltage - Supply1.7V~2V
Program / Erase Cycles100,000 cycles
Clock Frequency133MHz
Data Retention - TDR (Year)20 Years
Page Programming Time (Tpp)2ms
Standby Supply Current25uA
InterfaceSPI

Features

AI Translation
  • Serial Peripheral Interface (SPI) with multiple I/O
    • SPI clock polarity and phase modes 0 and 3
    • Double Data Rate (DDR) option
    • Extended addressing: 24-bit or 32-bit address option
    • Serial command subset and pinout compatible with S25FL1-K, S25FL-P, and S25FL-S SPI families
    • Multiple I/O command subset and pinout compatible with S25FL1-K, S25FL-P, and S25FL-S SPI families
    • Read:
      • Commands: Normal, Fast, Dual Output, Dual I/O, Quad Output, Quad I/O, DDR Quad I/O
      • Modes: Burst Wrap, Continuous (XIP), QPI
      • Serial Flash Discoverable Parameters (SFDP) and Common Flash Interface (CFI) for configuration information
    • Program:
      • 256-byte or 512-byte page program buffer
      • Program suspend and resume
      • Auto ECC — internal hardware Error Correction Code (ECC) generation with single-bit error correction
    • Erase:
      • Hybrid sector option
      • One group of eight 4 KB sectors and one 32 KB sector at the top or bottom of the address space, remaining sectors are 64 KB
      • Uniform sector option
      • Uniform 64 KB or 256 KB blocks for software compatibility with higher-density and future devices
      • Erase suspend and resume
      • Erase status evaluation
    • Endurance:
      • Minimum 100,000 program-erase cycles
    • Data Retention:
      • Minimum 20-year data retention
    • Security Features:
      • 1024-byte One-Time Programmable (OTP) array
      • Block protection:
        • Status register bits for program or erase protection control over contiguous sector ranges
        • Hardware and software control options
      • Advanced Sector Protection (ASP):
        • Individual sector protection controlled by boot code or password
        • Optional password-controlled read access
  • Technology:
    • 65 nm MIRRORBIT technology with ECLIPSE architecture
    • Single supply voltage with CMOS I/O
    • 1.7 V ~ 2.0 V
  • Temperature Range:
    • Industrial (-40°C ~ +85°C)
    • Industrial Plus (-40°C ~ +105°C)
    • Extended (-40°C ~ +125°C)
    • Automotive, AEC-Q100 Grade 3 (-40°C ~ +85°C)
    • Automotive, AEC-Q100 Grade 2 (-40°C ~ +105°C)
    • Automotive, AEC-Q100 Grade 1 (-40°C ~ +125°C)
  • Package (all lead-free):
    • 8-pin SOIC 208 mil (SOC008)
    • LGA 5×6 mm (W9A008)
    • BGA-24 6×8 mm
    • 5×5 ball (FAB024) pinout

Alternative Parts

MPNManufacturerPackagingAvailabilityUnit Price
MX25U6432FM2I02MXICSOP-8-208mil58$ 3.5972
W25Q64JWSSIQWinbondSOIC-8-208mil1,291$ 3.5255
W25Q64JWSSIQWinbondSOIC-8-208mil312$ 3.0805
W25Q64JWSSIMWinbondSOIC-8-208mil97$ 4.6951
XT25Q64FSSIGUXTXSOP-8-208mil50$1.2416 $1.552
IS25WP064A-JBLE-TRISSISOIC-8-208mil53$ 3.7103
MX25U6472FM2I02MXICSOIC-8-208mil0$ 1.3704
W25Q64JWSSIM TRWinbondSOIC-8-208mil0$ 2.6297
GD25LQ64ES2GRGigaDevice Semicon BeijingSOP-8-208mil0$ 0.6867
IS25WP064A-JBLEISSISOIC-8-208mil0$ 1.2231