Broadcom QCPL-329J-500E

The reliability data presented in this document contains reliability test results obtained from testing this product family. All of these products employ similar wafer technology. The data in Table 1 and Table 2 reflect actual device test data per channel. Prior to stress application, all devices were preconditioned under MSL 1 conditions through a reflow process (peak temperature 260°C) and 20 temperature cycles (-55°C to +125°C, 15-minute dwell, 1-minute transfer). This data is derived from Broadcom testing of its devices using internal process, material specifications, design standards, and statistical process control. This data cannot be applied to similar part types from other manufacturers.