MICROCHIP MCP2003AT-E/MD

This device provides a bidirectional, half-duplex communication, physical interface to automotive and industrial LIN systems to meet the LIN Bus Specification Revision 2.1 and SAE J2602. The device is short-circuit and overtemperature protected by internal circuitry. The device has been specifically designed to operate in the automotive operating environment and will survive all specified transient conditions, while meeting all of the stringent quiescent current requirements.

• The MCP2003/2003A and MCP2004/2004A are Compliant with Local Interconnect Network (LIN) Bus Specifications 1.3, 2.0 and 2.1, and are Compliant to SAE J2602
• Supports Baud Rates up to 20 Kbaud with LIN Bus Compatible Output Driver
• 43V Load Dump Protected
• Very Low/High Electromagnetic Immunity (EMI) meets Stringent Original Equipment Manufacturers (OEM) Requirements
• Very High Electrostatic Discharge (ESD) Immunity: >20 kV on VBB (IEC 61000 - 4 - 2), >14 kV on LBUS (IEC 61000 - 4 - 2)
• Very High Immunity to RF Disturbances meets Stringent OEM Requirements
• Wide Supply Voltage, 6.0V - 27.0V Continuous
• Extended Temperature Range: -40°C to +125°C
• Interface to P|C(B) MCU EUSART and Standard USARTs
• LIN Bus Pin: Internal pull - up resistor and diode, Protected against battery shorts, Protected against loss of ground, High - current drive
• Automatic Thermal Shutdown
• Low - Power mode: Receiver monitoring bus and transmitter off (≈5 µA)