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MICROCHIP AT24CM02-SSHM-BRoHS

Manufacturer
MICROCHIP
MPN
AT24CM02-SSHM-B
LCSC Part #
C615471
Packaging
SOIC-8
Customer #
Key Attributes
I2C-Compatible Serial EEPROM
Datasheetpdf iconMICROCHIP AT24CM02-SSHM-B
In-Stock: 43
43 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 4.3797$ 4.38
10+$ 3.8962$ 38.96
30+$ 3.608$ 108.24
100+$ 3.3166$ 331.66
500+$ 3.1831$ 1591.55
1,000+$ 3.1228$ 3122.80
Standard Packaging100/Full Tube
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerMICROCHIP
PackagingSOIC-8
Memory Size2Mbit
Voltage - Supply1.7V~5.5V
Operating temperature-40℃~+85℃
Clock Frequency1MHz
Access Time4500ns
FeaturesHardware write protection function;Built-in power-on reset (POR);Built-in error correction code (ECC) function;Noise suppression function
Data Retention - TDR (Year)100 Years
Current - Supply3mA
Write Cycle Time(tWC)10ms
Standby Supply Current3uA
Write Cycle Endurance1,000,000 cycles
InterfaceI2C
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging100
Sales UnitPiece

Features

AI Translation
  • Low-Voltage and Standard-Voltage Operation:
    • VCC = 1.7V to 5.5V
    • VCC = 2.5V to 5.5V
  • Internally Organized as 262,144×8 (2‑Mbit)
  • Industrial Temperature Range: -40°C to +85°C
  • I²C-Compatible (Two-Wire) Serial Interface:
    • 100 kHz Standard Mode, 1.7V to 5.5V
    • 400 kHz Fast Mode, 1.7V to 5.5V
    • 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V
  • Schmitt Triggers, Filtered Inputs for Noise Suppression
  • Bidirectional Data Transfer Protocol
  • Write-Protect Pin for Full Array Hardware Data Protection
  • Ultra Low Active Current (3 mA maximum) and Standby Current (3 µA maximum)
  • 256-byte Page Write Mode:
    • Byte write and partial page writes allowed
  • Random and Sequential Read Modes
  • Self-Timed Write Cycle:
    • All write operations complete within 10 ms maximum
  • Built-in Error Detection and Correction
  • High Reliability:
    • Endurance: 1,000,000 write cycles
    • Data retention: 100 years
  • Green Package Options (Lead-free/Halide-free/RoHS compliant)
  • Die Sale Options: Wafer Form and Bumped Wafers