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Infineon IRFZ44NSTRLPBFRoHS

Manufacturer
Infineon
MPN
IRFZ44NSTRLPBF
LCSC Part #
C58228
Packaging
D2PAK
Customer #
Key Attributes
MOSFET N-CH 55V 49A D2PAK
Datasheetpdf iconInfineon IRFZ44NSTRLPBF
In-Stock: 2,330
2,330 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 1.0667$ 1.07
10+$ 0.8729$ 8.73
30+$ 0.7752$ 23.26
100+$ 0.6791$ 67.91
500+$ 0.5065$ 253.25
800+$ 0.4772$ 381.76
Standard Packaging800/Full Reel
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Products Specifications

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TypeDescription
CategoryDiscrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs
ManufacturerInfineon
PackagingD2PAK
Drain to Source Voltage55V
Current - Continuous Drain(Id)49A
Operating Temperature --55℃~+175℃
Gate Threshold Voltage (Vgs(th))4V
Pd - Power Dissipation3.8W
Reverse Transfer Capacitance (Crss@Vds)88pF
RDS(on)17.5mΩ@10V
Number1 N-channel
Input Capacitance(Ciss)1.47nF
Gate Charge(Qg)63nC@10V
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging800
Sales UnitPiece

Introduction

AI Translation

Advanced HEXFET Power MOSFETs utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D²Pak is a surface mount power package capable of accommodating die sizes up to HEX - 4. It provides the highest power capability and the lowest possible on - resistance in any existing surface mount package. The D?Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through - hole version (IRFZ44NL) is available for low profile applications.

Features

AI Translation
  • Advanced Process Technology
  • Low - profile through - hole (IRFZ44NL)
  • 175°C Operating Temperature
  • Fast Switching
  • Fully Avalanche Rated
  • Lead - Free