VISHAY ACASN2002S2002P1AT

The production process is subject to strict controls, following a comprehensive set of instructions to ensure repeatability. A uniform metallic alloy thin film is deposited onto a high-grade ceramic substrate (Al₂O₃) using a mask to separate adjacent resistors, and is processed to achieve the desired temperature coefficient. Specially designed internal contacts are deposited on both sides. A specialized laser is used to smoothly cut meandering grooves in the resistive layer to reach the target value without damaging the ceramic. The resistive element is covered with a protective coating for electrical, mechanical, and climatic protection. Terminals receive a final pure matte nickel plating finish. Production results are verified through an extensive testing program and optical inspection of 100% of individual chip resistors. Only conforming products are placed directly into tape in accordance with IEC 60286-3, Type 1a (1).

• Excellent moisture resistance, |ΔR/R| < 0.5% (rated 85°C; 85% RH; 1000 hours)
• Per-resistor rated dissipation P₇₀ up to 125 mW
• ESD stability 1000 V, human body model, RoHS compliant
• Relative TCR as low as ±5 ppm/K (tracking)
• Relative tolerance as low as ±0.05% (matching), halogen-free
• AEC-Q200 qualified
• Advanced sulfur resistance verified per ASTM B 809
• Freely selectable resistance values
• Material category: for compliance definitions, refer to www.vishay.com/doc?99912

Automotive, industrial equipment, precision analog circuits, voltage dividers, feedback circuits