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HYNIX H26M78208CMRI product image
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HYNIX H26M78208CMRIRoHS

Manufacturer
MPN
H26M78208CMRI
LCSC Part #
C51891848
Packaging
FBGA-153
Customer #
Key Attributes
FBGA-153 Memory (ICs) RoHS
Datasheetpdf iconHYNIX H26M78208CMRI
In-Stock: 5
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QtyUnit PriceTotal Amount
1+$ 35.4192$ 35.42
10+$ 34.3396$ 343.40
Standard Packaging168/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerHYNIX
PackagingFBGA-153
FeaturesBuilt-in wear leveling function;Bad block management function;Garbage collection function;ECC error correction function;Power-down data protection function;Hardware reset function;Secure write protection function

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging168
Sales UnitPiece

Introduction

AI Translation

SK hynix e-NAND consists of NAND flash and MMC controller. e-NAND has the built-in intelligent controller which manages interface protocols, wear leveling, bad block management, garbage collection, and ECC. e-NAND protects the data contents from the host sudden power off failure. e-NAND is compatible with JEDEC standard eMMC5.1 specification.

Features

AI Translation
  • eMMC5.1 compatible (Backward compatible to eMMC4.5&eMMC5.0)
  • Bus mode:
    • Data bus width: 1bit(default), 4bits, 8bits
    • Data transfer rate: up to 400MB/s (HS400)
    • MMC I/F Clock frequency: 0~200MHz
    • MMC I/F Boot frequency: 0~52MHz
  • Operating Voltage Range:
    • Vcc (NAND): 2.7V - 3.6V
    • Vccq (Controller): 1.7V - 1.95V / 2.7V ~ 3.3V
  • Temperature:
    • Operation (-25℃~+85℃)
    • Storage without operation (-40℃ ~+85℃)
  • This product is compliance with the RoHS directive
  • Supported Features:
    • HS400, HS200
    • HPI, BKOPS, BKOP operation control
    • Packed CMD, CMD queuing
    • Cache, Cache barrier, Cache flushing report
    • Partitioning, RPMB, RPMB throughput improve
    • Discard, Trim, Erase, Sanitize
    • Write protect, Secure write protection
    • Lock/Unlock
    • PON, Sleep/Awake
    • Reliable Write
    • Boot feature, Boot partition
    • HW/SW Reset
    • Field Firmware Update
    • Configurable driver strength
    • Health(Smart) report
    • Production state awareness
    • Secure removal type
    • Data Strobe pin, Enhanced data strobe