TECHFUSE SMD150L-60V

Using a PTC beyond its maximum ratings or improper use may cause device damage and could generate arcing and flames. If the device is not handled in accordance with recommended electrical, thermal, and mechanical procedures, its performance may be adversely affected. Using a PPTC in a circuit with large inductors can generate circuit voltages exceeding the PPTC's rated voltage (L di/dt). Applying stress to PTC devices or mounting them in confined spaces should be avoided to prevent interference with thermal expansion. Recommended reflow soldering methods: infrared reflow, vapor phase reflow, hot air reflow. The device is not designed for wave soldering on the bottom side of the PCB. The recommended maximum solder paste thickness is 0.25mm. Devices can be soldered using standard methods and solvents. Note: If the reflow temperature exceeds the recommended profile, the device may fail to meet performance requirements. Storage conditions: maximum 40°C, 70% relative humidity. If storage conditions are exceeded, the device may not achieve the specified performance.