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TI TMS320DM642AZDK6

Manufacturer
MPN
TMS320DM642AZDK6
LCSC Part #
C468279
Packaging
FCBGA-548
Customer #
Key Attributes
Video/Imaging Fixed-Point Digital Signal Processor
Datasheetpdf iconTI TMS320DM642AZDK6

Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors)
ManufacturerTI
PackagingFCBGA-548
ROM Size-
Operating Temperature-40℃~+105℃
FeaturesHardware MAC acceleration;Parallel data channel;DMA data transfer;High-speed peripheral interface;RTC and timer
Maximum Speed720MHz
FLASH Size-

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging60
Sales UnitPiece

Introduction

AI Translation

The TMS320C64x™ DSPs (including the TMS320DM642 device) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The TMS320DM642 (DM642) device is based on the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™), making these DSPs an excellent choice for digital media applications. The C64x™ is a code-compatible member of the C6000™ DSP platform. With performance of up to 5760 million instructions per second (MIPS) at a clock rate of 720 MHz, the DM642 device offers cost-effective solutions to high-performance DSP programming challenges. The DM642 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)—with VelociTI.2™ extensions. The VelociTI.2™ extensions in the eight functional units include new instructions to accelerate the performance in video and imaging applications and extend the parallelism of the VelociTI™ architecture. The DM642 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2880 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 5760 MMACS. The DM642 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000™ DSP platform devices. The DM642 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. The peripheral set includes: three configurable video ports; a 10/100 Mb/s Ethernet MAC (EMAC); a management data input/output (MDIO) module; a VCXO interpolated control port (VIC); one multichannel buffered audio serial port (McASP0); an inter-integrated circuit (I2C) Bus module; two multichannel buffered serial ports (McBSPs); three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a peripheral component interconnect (PCI); a 16-pin general-purpose input/output port (GP0) with programmable interrupt/event generation modes; and a 64-bit glueless external memory interface (EMIFA), which is capable of interfacing to synchronous.

Features

AI Translation
  • High-Performance Digital Media Processor
    • 2-, 1.67-, 1.39-ns Instruction Cycle Time
    • 500-, 600-, 720-MHz Clock Rate
    • Eight 32-Bit Instructions/Cycle
    • 4000, 4800, 5760 MIPS
    • Fully Software-Compatible With C64x™
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2™ Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16×16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8×8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting VelociTI.2™ Increased Orthogonality
  • L1/L2 Memory Architecture
    • 128K-Bit (16K-Byte) L1P Program Cache (Direct Mapped)
    • 128K-Bit (16K-Byte) L1D Data Cache (2-Way Set-Associative)
    • 2M-Bit (256K-Byte) L2 Unified Mapped RAM/Cache (Flexible RAM/Cache Allocation)
  • Endianess: Little Endian, Big Endian
  • 64-Bit External Memory Interface (EMIF)
    • Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)
    • 1024M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • 10/100 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Media Independent Interface (MII)
    • 8 Independent Transmit (TX) Channels and 1 Receive (RX) Channel
  • Management Data Input/Output (MDIO)
  • Three Configurable Video Ports
    • Providing a Glueless I/F to Common Video Decoder and Encoder Devices
    • Supports Multiple Resolutions/Video Stds
  • VCXO Interpolated Control Port (VIC)
    • Supports Audio/Video Synchronization
  • Host-Port Interface (HPI) [32-/16-Bit]
  • 32-Bit/66-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface Conforms to PCI Specification 2.2
  • Multichannel Audio Serial Port (McASP)
    • Eight Serial Data Pins
    • Wide Variety of I²S and Similar Bit Stream Formats
    • Integrated Digital Audio I/F Transmitter Supports S/PDIF, IEC60958-1, AES-3, CP-430 Formats
  • Inter-Integrated Circuit (I²C Bus™)
  • Two Multichannel Buffered Serial Ports
  • Three 32-Bit General-Purpose Timers
  • Sixteen General-Purpose I/O (GPIO) Pins
  • Flexible PLL Clock Generator
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 548-Pin Ball Grid Array (BGA) Package (GDK and ZDK Suffixes), 0.8-mm Ball Pitch
  • 548-Pin Ball Grid Array (BGA) Package (GNZ and ZNZ Suffixes), 1.0-mm Ball Pitch
  • 0.13-μm/6-Level Cu Metal Process (CMOS)
  • 3.3-V I/O, 1.2-V Internal (-500)
  • 3.3-V I/O, 1.4-V Internal (A-500, A-600, -600, -720)
In-Stock: 37
37 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 38.6402$ 38.64
30+$ 36.8719$ 1106.16
Standard Packaging60/Full Tray
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