Walsin WR12X3652FTL

The resistors are constructed using a high-grade ceramic body (alumina). Internal metal electrodes are added at both ends and connected by a resistive paste coated on the top surface of the substrate. The composition of the resistive paste is adjusted to obtain the required approximate resistance value, and the resistance is trimmed to within tolerance by laser cutting the resistive layer. The resistive layer is covered with a protective coating. Finally, two external terminations are added. To facilitate soldering, the outer layer of these terminations is a tin (lead-free) alloy. The standard values of nominal resistance are taken from the E24 series for resistors with ±5% tolerance and the E96 series for resistors with ±1% tolerance. The E24/E96 series values conform to "IEC Publication 60063". Due to their rectangular shape and tight tolerances, SMT resistors are suitable for handling by automated placement systems. The chips can be mounted on ceramic substrates and PCBs. Electrical connection to the circuit is achieved through individual soldering conditions. It is recommended that products be used within two years from the date of operation to ensure shelf life. For extended shelf life, solderability should be verified. Products should be stored under the following conditions: Temperature: 5 to 40°C Humidity: 20% to 70% RH Precautions: a. Do not store products in corrosive environments such as sulfide or chloride gases or acids, as these may cause electrode oxidation, which can lead to poor solderability. b. Store products on shelves, away from humid environments. c. Do not subject products to excessive shock, vibration, direct sunlight, or similar conditions. The robust construction of chip resistors allows them to be fully immersed in a solder bath at 260°C for 10 seconds. Therefore, SMT resistors can be mounted on one side of a PCB while other discrete components are mounted on the other side (mixed PCB). SMT resistors are tested for solderability at 235°C for 2 seconds. The test condition for no leaching is 260°C for 30 seconds. Figure 3 provides examples of typical soldering processes that ensure reliable connections without any damage.

• High reliability and stability
• Reduced end-device size
• Lower assembly cost
• Improved component and device reliability
• RoHS 2 compliant, Exemption 7C-I, halogen-free
• UL94-V0 flame retardancy rating compliant

• Consumer electronics equipment
• Electronic data processing and computer applications
• Telecommunications applications