MICROCHIP MAUPTB33E3

Microchip’s unique Powermite MUPT series of transient voltage suppressors feature oxide-passivated chips with high-temperature solder bonds for high surge capability and negligible electrical degradation under repeated surge conditions. Both unidirectional and bidirectional confgurations are available. In addition to its size advantages, the Powermite package includes a fully metallic bottom side that eliminates the possibility of solder fux entrapment at assembly and a unique locking tab design that serves as an integral heat sink. Its innovative design makes this device fully compatible for use with automatic insertion equipment.

• Powermite package with working stand-of voltages 5 to 48V
• 3(σ) lot norm screening performed on standby current (I_D) for all M prefx devices
• Both unidirectional and bidirectional polarities: Anode to case bottom (MUPT5e3 thru MUPT48e3), Cathode to case bottom (MUPT8Re3 thru MUPT48Re3), Bidirectional (MUPTB5e3 thru MUPTB48e3)
• Suppress transients up to 150 watts at 10/1000 µs
• Enhanced reliability screening options are available in reference to MIL-PRF-19500
• High reliability devices with fabrication and assembly lot traceability for all M prefx devices
• Clamping time less than 100 pico-seconds for unidirectional and 5 nano-seconds for bidirectional
• 100% surge current testing of all parts
• Moisture classifcation is Level 1 with no dry pack required per IPC/JEDEC J-STD-020F
• RoHS compliant versions available

• Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, and so on
• Protection from switching and induced RF transients
• Integral heat sink/locking tabs
• Fully metallic bottom side eliminates fux entrapment
• Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD and EFT protection respectively
• Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Class 1: MUPT5 or MUPTB8 to MXLUPT17 or MXLMUPTB17, Class 2: MUPT5 or MUPTB8 to MXLUPT12 or MXLMUPTB12