TI TMP103HYFFT

The TMP103 is a digital output temperature sensor in a wafer chip-scale package (WCSP) that is optimal for thermal management and thermal profiling. The TMP103 includes a two-wire interface that is compatible with both I²C and SMBus interfaces. In addition, the TMP103 has the capability of executing multiple device access (MDA) commands that allow multiple TMP103s to respond to a single global bus command. MDA commands reduce communication time and power in a bus that contains multiple TMP103 devices. The TMP103 is specified over a temperature range of -40℃ to +125℃. The TMP103 serial interface is designed to support up to eight TMP103 devices on a single bus. The TMP103 is offered with eight internal interface addresses. Each unique address option can be used as a location or temperature zone designator. The TMP103 responds to standard I2C/SMBus slave protocols that allow the internal registers to be written to or read from on an individual basis. The TMP103 also responds to MDA commands that allow all the devices on the bus to be written to or read from, without having to send the individual address and commands to each device.

• Multi-Device Access (MDA): global read/write operations
• I2C™/SMBus™ compatible interface
• Resolution: 8-bit
• Accuracy: ±1℃ typical (−40℃ to +100℃)
• Low quiescent current: I₀ = 3μA in active mode (at 0.25Hz), I₀ = 1μA in shutdown mode
• Supply voltage range: 1.4V to 3.6V
• Digital output
• Package: 4-ball WCSP (DSBGA)

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