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Honeywell HSCDRRN005NDAA5

Produttore
Cod. Prod.
HSCDRRN005NDAA5
Cod. LCSC
C3263417
Imballo
DIP-8
Numero Cliente
Attr. chiave
DIP-8 Pressure Sensors, Transducers RoHS
Scheda TecnicaHoneywell HSCDRRN005NDAA5
Conformità RoHS1 documenti disponibili
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaSensors, Transducers/Pressure Sensors, Transducers
ProduttoreHoneywell
ImballoDIP-8
Pressure range-
FeaturesOn-chip temperature compensation;Integrated ADC and digital interface;On-chip self-diagnosis;Standby mode
ModuleYes
Voltage - Supply4.95V~5.05V
Operating Temperature-20℃~+85℃
Response time460us
InterfaceI2C;SPI

Descrizione

Traduzione AI

The TruStability High Accuracy Silicon Ceramic (HSC) Series is a piezoresistive silicon pressure sensor offering a ratiometric analog or digital output for reading pressure over the specified full scale pressure span and temperature range. The HSC Series is fully calibrated and temperature compensated for sensor offset, sensitivity, temperature effects, and nonlinearity using an on-board Application Specific Integrated Circuit (ASIC). Calibrated output values for pressure are updated at approximately 1 kHz for analog and 2 kHz for digital. The HSC Series is calibrated over the temperature range of 0 ℃ to 50 ℃ [32 °F to 122 °F]. The sensor is characterized for operation from a single power supply of either 3.3 Vdc or 5.0 Vdc. These sensors measure absolute, gage, or differential pressures. The absolute versions have an internal vacuum reference and an output value proportional to absolute pressure. Gage versions are referenced to atmospheric pressure and provide an output proportional to pressure variations from atmosphere. Differential versions allow measurement of pressure between the two pressure ports. The TruStability pressure sensors are intended for use with non-corrosive, non-ionic gases, such as air and other dry gases. Available options extend the performance of these sensors to non-corrosive, non-ionic liquids for pressure ranges above 40 mbar |4 KPa |20 inH₂O. All products are designed and manufactured according to ISO 9001 standards.

Caratteristiche

Traduzione AI
  • Stability and reliability
  • Industry-leading accuracy of ±0.25 % FSS BFSL
  • Port and housing options simplify integration
  • Wide pressure range, from ±1.6 mbar to ±10 bar I ±160 Pa to ±1 MPa I ±0.5 inH₂O to ±150 psi
  • Small package size
  • Extremely low power consumption
  • Combines high sensitivity with high overpressure and burst pressure while providing industry leading stability
  • Even after long-term use and thermal extremes, the sensor's stability remains best in class
  • Minimizes system calibration needs
  • Improves system performance
  • Helps support system uptime by minimizing the need to service or replace the sensor during its application life
  • Honeywell specifies TEB - the most comprehensive, clear, and meaningful measurement - that provides the sensor's true performance over a compensated range of 0 ℃ to 50 ℃ [32 °F to 122 °F]
  • Minimizes individually testing and calibrating every sensor, decreasing manufacturing time and process costs
  • Improves system accuracy
  • Provides enhanced sensor interchangeability — there is minimal part - to - part variation in accuracy
  • Extremely tight accuracy of ±0.25 % FSS BFSL (Full Scale Span Best Fit Straight Line) reduces software needed to correct system inaccuracies, minimizing system design time
  • Avoids additional customer calibration
  • Helps to improve system efficiency
  • Often simplifies software development
  • Promotes system reliability and reduces potential system downtime
  • Can simplify the design process
  • Allows ultra - low pressure sensors to be used continuously well above the calibrated pressure range
  • Modular, flexible design with many package styles (with the same industry - leading stability), pressure ports, and options simplify integration into the device manufacturer's application
  • From ±1.6 mbar to ±10 bar I ±160 Pa to ±1 MPa I ±0.5 inH₂O to 150 psi provide support for many unique applications
  • Allows the customer to avoid the thermal and mechanical damage during solder reflow attachment and/or repair that lesser rated products would incur
  • Allows unlimited floor life when stored as specified (≤30 ℃/85 % RH) simplifying storage and reducing scrap
  • Never requires lengthy bakes prior to reflow
  • Stable and usable shortly after reflow process allows for lean manufacturing
  • May reduce the need for redundant sensors in the system
  • Detects most internal faults