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ESPRESSIF ESP32-S3 product image
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ESPRESSIF ESP32-S3RoHS

Manufacturer
ESPRESSIFAsian Brands
MPN
ESP32-S3
LCSC Part #
C2913192
Packaging
QFN-56-EP(7x7)
Customer #
Key Attributes
2.4GHz Wi-Fi+Bluetooth LE SoC
Datasheetpdf iconESPRESSIF ESP32-S3
In-Stock: 887
887 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 3.0192$ 3.02
10+$ 2.7106$ 27.11
30+$ 2.5277$ 75.83
100+$ 2.2939$ 229.39
500+$ 2.1905$ 1095.25
1,000+$ 2.1443$ 2144.30
Standard Packaging2000/Full Reel
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Products Specifications

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TypeDescription
CategoryRF and Wireless/RF Transceiver ICs
ManufacturerESPRESSIF
PackagingQFN-56-EP(7x7)
Sensitivity-98.4dBm
Data Rate150Mbps
Frequency Range2.412GHz~2.484GHz
Typical Application Frequency2.4GHz
Output Power21dBm
Receive Current88mA
Interface TypeADC;I2C;I2S;PWM;SPI;UART;USB
Operating Temperature-40℃~+105℃
Voltage - Supply3V~3.6V
FeaturesSupports software reset
Typetransceiver
Current Of Transmitting340mA

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2000
Sales UnitPiece

Introduction

AI Translation

ESP32-S3 is a low-power MCU-based system on a chip (SoC) with integrated 2.4 GHz Wi-Fi and Bluetooth Low Energy (Bluetooth LE). It consists of high-performance dual-core microprocessor (Xtensa 32-bit LX7), a ULP coprocessor, a Wi-Fi baseband, a Bluetooth LE baseband, RF module, and numerous peripherals.

Features

AI Translation
  • Wi-Fi:
    • IEEE 802.11b/g/n-compliant
    • Supports 20 MHz and 40 MHz bandwidth in 2.4 GHz band
    • 1T1R mode with data rate up to 150 Mbps
    • Wi-Fi Multimedia (WMM)
    • TX/RX A-MPDU, TX/RX A-MSDU
    • Immediate Block ACK
    • Fragmentation and defragmentation
    • Automatic Beacon monitoring (hardware TSF)
    • Four virtual Wi-Fi interfaces
    • Simultaneous support for Infrastructure BSS in Station, SoftAP, or Station + SoftAP modes
    • Antenna diversity
    • 802.11mc FTM
  • Bluetooth:
    • Bluetooth LE: Bluetooth 5, Bluetooth mesh
    • High power mode (20 dBm)
    • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
    • Advertising extensions
    • Multiple advertisement sets
    • Channel selection algorithm #2
    • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna
  • CPU and Memory:
    • Xtensa dual-core 32-bit LX7 microprocessor
    • Clock speed: up to 240 MHz
    • CoreMark score: One core at 240 MHz: 613.86 CoreMark; 2.56 CoreMark/MHz; Two cores at 240 MHz: 1181.60 CoreMark; 4.92 CoreMark/MHz
    • Five-stage pipeline
    • 128-bit data bus and dedicated SIMD instructions
    • Single precision floating point unit (FPU)
    • L1 cache
    • ROM: 384 KB
    • SRAM: 512 KB
    • SRAM in RTC: 16 KB
    • Supported SPI protocols: SPI, Dual SPI, Quad SPI, Octal SPI, QPI and OPI interfaces that allow connection to flash, external RAM, and other SPI devices
    • Flash controller with cache is supported
    • Flash in-Circuit Programming (ICP) is supported
  • Advanced Peripheral Interfaces:
    • 45 programmable GPIOs
    • Digital interfaces: Two SPI ports for communication with flash and RAM; Two general-purpose SPI ports; LCD interface (8-bit ~ 16-bit parallel RGB, I8080 and MOTO6800), supporting conversion between RGB565, YUV422, YUV420 and YUV411; DVP 8-bit ~ 16-bit camera interface; Three UARTs; Two I2Cs; Two I2Ss; RMT (TX/RX); Pulse counter; LED PWM controller, up to 8 channels; Full-speed USB OTG; USB Serial/JTAG controller; Two Motor Control PWMs (MCPWM); SD/MMC host controller with 2 slots; General DMA controller (GDMA), with 5 transmit channels and 5 receive channels; TWAI controller, compatible with ISO 11898-1 (CAN Specification 2.0)
    • On-chip debug functionality via JTAG
    • Analog interfaces: Two 12-bit SAR ADCs, up to 20 channels; Temperature sensor; 14 touch sensing IOs
    • Timers: Four 54-bit general-purpose timers; 52-bit system timer; Three watchdog timers
  • Low Power Management:
    • Fine-resolution power control through a selection of clock frequency, duty cycle, Wi-Fi operating modes, and individual power control of internal components
    • Four power modes designed for typical scenarios: Active, Modem-sleep, Light-sleep, Deep-sleep
    • Power consumption in Deep-sleep mode is as low as 7 µA
    • Ultra-Low-Power (ULP) coprocessors: ULP-RISC-V coprocessor; ULP-FSM coprocessor
    • RTC memory remains powered on in Deep-sleep mode
  • Security:
    • Secure boot
    • Flash encryption
    • 4-Kbit OTP, up to 1792 bits for users
    • Cryptographic hardware acceleration: AES-128/256 (FIPS PUB 197); SHA (FIPS PUB 180-4); RSA; Random Number Generator (RNG); HMAC; Digital signature

Applications

AI Translation
  • Smart Home
  • Industrial Automation
  • Health Care
  • Consumer Electronics
  • Smart Agriculture
  • POS machines
  • Service robot
  • Audio Devices
  • Generic Low-power IoT Sensor Hubs
  • Generic Low-power IoT Data Loggers
  • Cameras for Video Streaming
  • USB Devices
  • Speech Recognition
  • Image Recognition
  • Wi-Fi + Bluetooth Networking Card
  • Touch and Proximity Sensing