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LITEON LTV-817S-TA1-ARoHS

Manufacturer
LITEONAsian Brands
MPN
LTV-817S-TA1-A
LCSC Part #
C22113
Packaging
SMD-4P
Customer #
Key Attributes
OPTOISOLATOR 5kV 1CH SMD-4P
Datasheetpdf iconLITEON LTV-817S-TA1-A
In-Stock: 7,345
7,345 In stock, ships now
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QtyUnit PriceTotal Amount
5+$ 0.0815$ 0.41
50+$ 0.0657$ 3.29
150+$ 0.0578$ 8.67
1,000+$ 0.0519$ 51.90
2,000+$ 0.0471$ 94.20
5,000+$ 0.0448$ 224.00
Standard Packaging1000/Full Reel
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Products Specifications

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TypeDescription
CategoryIsolators/Optocouplers, Optoisolators/Transistor, Photovoltaic Output Optoisolators
ManufacturerLITEON
PackagingSMD-4P
Rise time4us
Output Current50mA
Fall time3us
Vce Saturation(VCE(sat))100mV@20mA,1mA
Load Voltage35V
Reverse Voltage6V
Current transfer ratio600%;50%
Voltage - Forward(Vf)1.2V
Forward Current(If)50mA
Number of Channels1
Total Power Dissipation(Pd)200mW
Operating Temperature-50℃~+110℃
Output Type-
Input typeDC
Isolation Voltage(Vrms)5kV
Features-

Additional Information

TypeDetails
Minimum5
Multiple5
Standard Packaging1000
Sales UnitPiece

Features

AI Translation
  • Current transfer ratio ( CTR: MIN. 50% at lF = 5 mA, VCE = 5 V)
  • High input-output isolation voltage ( Viso = 5,000 Vrms)
  • Response time ( tr: TYP. 4 μs at VCE = 2 V, IC = 2 mA, RL = 100 Ω)
  • Dual-in-line package: LTV-817: 1-channel type LTV-827: 2-channel type LTV-847: 4-channel type
  • Wide lead spacing package: LTV-817M: 1-channel type LTV-827M: 2-channel type LTV-847M: 4-channel type
  • Surface mounting package: LTV-817S: 1-channel type LTV-827S: 2-channel type LTV-847S: 4-channel type
  • Tape and reel packaging: LTV-817S-TA: 1-channel type LTV-817S-TA1: 1-channel type LTV-817S-TP: 1-channel type LTV-827S-TA1: 2-channel type
  • Safety approval UL 1577 VDE DIN EN60747-5-5 (VDE 0884-5) CSA CA5A CQC GB4943.1-2011/ GB8898-2011 (meet Altitude up to 5000m) Nordic Safety ( FIMKO/NEMKO/SEMKO/DEMKO) BSI
  • RoHS Compliance All materials be used in device are followed EU RoHS directive
  • ESD pass HBM 8000V/MM2000V
  • MSL class1

Applications

AI Translation
  • Hybrid substrates that require high density mounting.
  • Programmable controllers