TI CC2564CRVMR

The TI CC2564C device is a complete Bluetooth BR, EDR, and Low Energy HCI solution designed to reduce design effort and shorten time to market. Based on TI's 7th-generation Bluetooth core, the CC2564C delivers a proven solution compliant with the Bluetooth 4.2 specification. When paired with a microcontroller unit (MCU), this HCI device provides optimum RF performance, with an RF range approximately twice that of other Bluetooth Low Energy solutions. In addition, TI's power management hardware and software algorithms significantly reduce power consumption across all commonly used Bluetooth BR, EDR, and Low Energy operating modes. TI's dual-mode Bluetooth protocol stack software is certified and royalty-free, supporting both MCU and MPU platforms. iPod (MFi) protocol support is available via an additional software package. Multiple profiles and sample applications are supported, including Serial Port Profile (SPP), Advanced Audio Distribution Profile (A2DP), Audio/Video Remote Control Profile (AVRCP), Hands-Free Profile (HFP), Human Interface Device (HID), Generic Attribute Profile (GATT), and various Bluetooth Low Energy profiles and services.

• Single-chip Bluetooth solution supporting Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE)
• Bluetooth 4.2 compliant component (Declaration ID: D032801); compatible up to HCI layer
• Highly optimized for size-constrained and low-cost designs
• Single-ended 50Ω RF interface
• Package: 76-pin, 0.6mm pitch, 8mm×8mm (VQFNP-MR)
• Supports up to seven active devices
• Scatternet: supports up to three simultaneous piconets, one as master and two as slaves
• Supports up to two synchronous connection-oriented (SCO) links within the same piconet
• Supports all voice air coding — Continuous Variable Slope Delta (CVSD) coding, A-law, μ-law, modified Sub-Band Coding (mSBC), and transparent coding (uncoded)
• Auxiliary mode for HFP 1.6 Wide Band Speech (WBS) or A2DP profiles to reduce host processing load and power consumption
• Multiple Bluetooth profiles supported with enhanced QoS
• Multiple sniff instances tightly integrated to minimize power consumption
• Independent buffering for LE mode allows extensive multi-connection implementations without impacting BR or EDR performance
• Built-in coexistence and optimization for BR, EDR, and LE modes
• Link Layer topology scatternet capability — simultaneous peripheral and central device operation
• Network support for up to 10 devices
• Timeline optimization algorithm for maximum channel utilization
• Optimal Bluetooth RF performance (TX power, RX sensitivity, blocking)
• Class 1 TX power up to +12dBm
• Internal temperature detection and compensation for minimal RF performance variation over temperature range, no external calibration required
• Improved Adaptive Frequency Hopping (AFH) algorithm with minimal adaptation time covering twice the range of LE-only solutions
• On-chip power management including direct battery connection
• Low power consumption in active, standby, and scanning Bluetooth modes
• Shutdown and sleep modes for minimized power consumption
• UART interface supporting maximum Bluetooth data rates
• UART transport layer (H4) up to 4Mbps
• Three-wire UART transport layer (H5) up to 4Mbps
• Fully programmable digital PCM/I2S codec interface
• MCU and MPU support
• CC256x Bluetooth Hardware Evaluation Tool: PC application for evaluating device RF performance and configuring service packs

• Wireless audio solutions
• mPOS
• Medical devices
• Set-top box (STB)
• Wearable devices
• Sensor hub, sensor gateway
• Home and factory automation