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RENESAS IDT71V3577YS65PFG product image
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RENESAS IDT71V3577YS65PFG

Manufacturer
MPN
IDT71V3577YS65PFG
LCSC Part #
C20428568
Packaging
100-TQFP (14x14)
Customer #
Key Attributes
4.5Mbit Parallel Port (Parallel) 100-TQFP (14x14) Memory
DatasheetRENESAS IDT71V3577YS65PFG
Alternative Parts5
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QtyUnit Price(Reference Only)Total Amount
1+$ 11.9836$ 11.98
216+$ 4.7813$ 1032.76
504+$ 4.6219$ 2329.44
1,008+$ 4.5429$ 4579.24
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerRENESAS
Packaging100-TQFP (14x14)
Operating Temperature0℃~+70℃
FeaturesAuto power-down function;Boundary scan (JTAG) function
Memory Size4.5Mbit
Voltage - Supply300mA;3.135V~3.465V
Access Time6.5ns
Standby Supply Current30mA
InterfaceParallel Port (Parallel)

Introduction

AI Translation

The IDT71V3577/79 are high-speed SRAMs organized as 128K x 36/256K x 18. The IDT71V3577/79 SRAMs contain write, data, address and control registers. There are no registers in the data output path (flow-through architecture). Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as the IDT71V3577/79 can provide four cycles of data for a single address presented to the SRAM. An internal burst address counter accepts the first cycle address from the processor, initiating the access sequence. The first cycle of output data will flow-through from the array after a clock-to-data access time delay from the rising clock edge of the same cycle. If burst mode operation is selected (ADV=LOW), the subsequent three cycles of output data will be available to the user on the next three rising clock edges. The order of these three addresses are defined by the internal burst counter and the LBO input pin. The IDT71V3577/79 SRAMs utilize IDT’s latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and a 165 fine pitch ball grid array (fBGA).

Features

AI Translation
  • 128K x 36, 256K x 18 memory configurations
  • Supports fast access times: Commercial: – 6.5ns up to 133MHz clock frequency – 7.5ns up to 117MHz clock frequency Commercial and Industrial: – 8.0ns up to 100MHz clock frequency – 8.5ns up to 87MHz clock frequency
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW (overline)), byte write enable (BWE), and byte writes (BW (overline) x)
  • 3.3V core power supply
  • Power down controlled by ZZ input
  • 3.3V I/O
  • Optional - Boundary Scan JTAG Interface (IEEE 1149.1 compliant)
  • Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array

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