RENESAS R5F571MFHGFP#V0

240- MHz 32- bit RX MCU, on- chip FPU, 480 DMIPS, up to 4- MB flash memory, 512- KB SRAM, various communications interfaces including IEEE 1588- compliant Ethernet MAC, high- speed USB 2.0 with battery charging, SD host interface (optional), quad SPI, and CAN, 12- bit A/D converter, RTC, encryption (optional), serial interface for audio, CMOS camera interface

• 32-bit RXv2 CPU core:
  • Max. operating frequency: 240 MHz
  • Extremely high resolution FIFPS: 1200 MHz
  • Single precision 32-bit IEEE-754 floating point
  • Two types of multiply-and-accumulation unit (between memories and between registers)
  • 32-bit multiplier (fastest instruction execution takes one CPU clock cycle)
  • Diverse (fastest instruction execution takes two CPU clock cycles)
  • Fast interrupt
  • CISC Harvard architecture with 5-stage pipeline
  • Variable-length instructions: Ultra-compact code
  • Supports the memory protection unit (MPL)
  • JTAG and FINE (one-line) debugging interfaces
• Low-power design and architecture:
  • Single voltage supply: 2.7 to 3.6V
  • Low power consumption: A product that supports all peripheral functions draws only 0.2mA/MHz (Typ.)
  • RTC is capable of operation from a dedicated power supply.
  • Four low-power modes
• On-chip code flash memory:
  • Up to 4 Mbyte
  • No wait states at up to 120MHz or when the AFU is hit, one wait state at above 120MHz and when the AFU is missed
  • User code is programmable by on-board or off-board programming.
  • Background programming/erasing (BGO/Background operation)
• On-chip data flash memory:
  • 64 Kbytes, reprogrammable up to 100,000 times
  • Background programming/erasing (BGO/Background operation)
• On-chip SRAM:
  • 512 Kbytes of SRAM (no wait states except in the 256 Kbytes from 0004 0000h to 0007 FFFFh when ICLK is set to 120MHz or faster)
  • 32 Kbytes of RAM with ECC (single-error correction and double error detection)
  • 8 Kbytes of standby RAM (backup on deep software standby)
• Data transfer:
  • DMAC: 8 channels
  • DTC
  • EXDMAC: 2 channels
  • DMAC for the Ethernet controller: 3 channels for 176- and 177-pin products; 2 channels for 100-, 144-, and 145-pin products
• Reset and supply management:
  • Power-on reset (POR)
  • Low voltage detection (LVD) with voltage settings
• Clock functions:
  • External crystal resonator or internal PLL for operation at 8 to 24 MHz
  • Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20 MHz
  • 120-kHz clock for the IWD Ta
• Real-time clock:
  • Real-time clock
  • Adjustment functions (30 seconds, leap year, and error)
  • Real-time clock counting and binary counting modes are selectable
  • Time capture function (for capturing times in response to event-signal input)
• Independent watchdog timer:
  • 120-kHz (1/2 LOCO frequency) clock operation
• Useful functions for IEC60730 compliance:
  • Oscillation-stoppage detection, frequency measurement, CRC, IWD Ta, self-diagnostic function for the A/D converter, etc.
  • Register write protection function can protect values in important registers against overwriting.
• Various communications interfaces:
  • IEEE 1588-compliant Ethernet MAC (for 176- and 177-pin products: 2 modules)
  • PHY layer for host/function or OTG controller (1) with high-speed USB 2.0 with battery charging transfer (only for 176- and 177-pin products)
  • PHY layer (1) for host/function or OTG controller (1) with full-speed USB 2.0 transfer
  • CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3 modules)
  • SC1g and SC1h with multiple functionalities (up to 9) Choose from among asynchronous mode, clock-synchronous mode, smart-card interface mode, simplified SPI, simplified I2C, and extended serial mode.
  • SCIFA with 16-byte transmission and reception FIFOs (up to 4 interfaces)
  • I2C bus interface for transfer at up to 1 Mbps (up to 2 interfaces)
  • Four-wire QSPI (1 interface) in addition to RSPla (2 interfaces)
  • Parallel data capture unit (PDC) for the CMOS camera interface (not in 100-pin products)
  • SD host interface (optional: 1 interface) with a 1- or 4-bit SD bus for use with SD memory or SDIO
  • MMCIF with 1-, 4-, or 8-bit transfer bus width
• External address space:
  • Buses for full-speed data transfer (max. operating frequency of 60 MHz)
  • 8 CS areas
  • 8-, 16- or 32-bit bus space is selectable per area
  • Independent SDRAM area (128 Mbytes)
• Up to 29 extended-function timers:
  • 16-bit TPUa, MTU3a, and GPTA: input capture, output compare, PWM waveform output
  • 8-bit TMRa (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2 channels)
• 12-bit A/D converter:
  • Two 12-bit units (8 channels for unit 0; 21 channels for unit 1)
  • Self diagnosis
  • Detection of analog input disconnection
• 12-bit D/A converter: 2 channels
  • On-chip operational amplifier output or direct input selectable
• Temperature sensor for measuring temperature within the chip
• Encryption (optional):
  • AES (key lengths: 128/192, and 256 bits)
  • DES (key lengths: 56 bits (DES); 3 × 56 bits (T-DES))
  • SHA (SHA-1 (128), SHA-2 (224 or 256), HMAC (160, 224, or 256))
• Up to 127 pins for general I/O ports:
  • 5-V tolerance, open drain, input pull-up, switchable driving ability
• Operating temp. range:
  • D-version: -40°C to +85°C
  • G-version: -40°C to +105°C