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Broadcom HCPL-070A#500

Hersteller
Herst.-Teilenr.
HCPL-070A#500
LCSC-Nr.
C17505616
Verp.
SO-8
Kundennummer
Hauptmerkm.
60mA 1.25V SO-8 Transistor, Photovoltaic Output Optoisolators
DatenblattBroadcom HCPL-070A#500
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1+$ 7.6919$ 7.69
200+$ 3.0698$ 613.96
500+$ 2.9666$ 1483.30
1,500+$ 2.9174$ 4376.10
Standardgehäuse1500/Full Reel
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Produktspezifikationen

Alle
TypBeschreibung
KategorieIsolators/Optocouplers, Optoisolators/Transistor, Photovoltaic Output Optoisolators
HerstellerBroadcom
Verp.SO-8
Output Current60mA
Operating Temperature0℃~+70℃
Voltage - Forward(Vf)1.25V
Isolation Voltage(Vrms)3.75kV
Number of Channels1
FeaturesDarlington output structure

Beschreibung

KI-Übersetzung

These Broadcom devices are ultra-low power, high-gain single-channel and dual-channel optocouplers. The HCPL-4701 represents a single-channel 8-pin DIP configuration, pin-compatible with the industry-standard 6N139. The HCPL-4731 represents a dual-channel 8-pin DIP configuration, pin-compatible with the popular standard HCPL-2731. The HCPL-070A and HCPL-073A are equivalent single-channel and dual-channel products in SO-8 packages. Each channel can be driven with an input current as low as 40 μA, with a typical current transfer ratio of 3500%.

These high-gain optocouplers use an AlGaAs LED and an integrated high-gain photodetector to provide an extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage enable TTL-compatible saturation voltage and high-speed operation. If desired, the VCC and VO terminals can be connected together for conventional Darlington operation (single-channel packages only).

These devices are designed for CMOS, LSTTL, or other low-power applications. Due to their low power consumption, they are particularly suitable for ISDN telephone interface and battery-powered applications. At an LED current of 40 μA and VCC ≥ 3V, a minimum current transfer ratio of 700% is guaranteed over an operating temperature range of 0°C to 70°C.

The SO-8 package eliminates the need for through-holes on the PCB. This package occupies approximately one-third the board area of a standard DIP package. The lead profile is designed to be compatible with standard SMT processes.

Caution! Normal ESD precautions should be taken when handling and assembling this component to prevent damage or performance degradation that may be caused by ESD. The components described in this datasheet shall not be used in military or applications or environments.

Merkmale

KI-Übersetzung
  • Ultra-low input current capability: 40 μA
  • Suitable for 3V operation
  • Typical power consumption: < 1 mW
  • Input power: < 50 μW
  • Output power: < 500 μW
  • Operates at VCC as low as 1.6V
  • High current transfer ratio: 3500% at IF = 40 μA
  • TTL and CMOS compatible output
  • AC and DC performance specified over 0°C to 70°C temperature range
  • Safety certifications
  • UL recognized: 3750 Vrms for 1 minute, 5000 Vrms for 1 minute per UL1577
  • CSA recognized
  • IEC/EN/DIN EN 60747-5-5 certified, VIORM = 630V peak (060 option for HCPL-4701)
  • 8-pin package compatible with 6N138/6N139 and HCPL-2730/HCPL-2731
  • Available in 8-pin DIP and SOIC-8 packages
  • Supports through-hole and surface mount assembly

Anwendungen

KI-Übersetzung
  • Battery-powered applications
  • ISDN telephone interfaces
  • Ground isolation between logic families (TTL, LSTTL, CMOS, HCMOS, HL-CMOS, LV-HCMOS)
  • Low input current line receivers
  • EIA RS-232C line receivers
  • Telephone ring detectors
  • AC line voltage status indicators - low input power consumption
  • Low-power systems - ground isolation
  • Portable system I/O interfaces