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ST SMBJ26CA-TRRoHS

Manufacturer
MPN
SMBJ26CA-TR
LCSC Part #
C133665
Packaging
SMB(DO-214AA)
Customer #
Key Attributes
53.5VC Clamp 75A@8/20us Ipp TVS DIODE SMB(DO-214AA)
Datasheetpdf iconST SMBJ26CA-TR
In-Stock: 1,775
1,775 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
5+$ 0.1894$ 0.95
50+$ 0.1535$ 7.68
150+$ 0.1381$ 20.72
500+$ 0.1189$ 59.45
2,500+$ 0.1103$ 275.75
5,000+$ 0.1052$ 526.00
Standard Packaging2500/Full Reel
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Products Specifications

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TypeDescription
CategoryCircuit Protection/Transient Voltage Suppressors (TVS)/TVS Diodes
ManufacturerST
PackagingSMB(DO-214AA)
Clamping Voltage53.5V
Peak Pulse Current (Ipp)75A@8/20us
Peak Pulse Power Dissipation (Ppp)4kW@8/20us
Voltage - Breakdown28.9V
typeTVS
Reverse Leakage Current (Ir)200nA
PolarityBidirectional
Reverse Stand-Off Voltage (Vrwm)26V

Additional Information

TypeDetails
Minimum5
Multiple5
Standard Packaging2500
Sales UnitPiece

Introduction

AI Translation

The SMBJ Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 600 W (10/1000 μs). Planar technology makes these devices suitable for high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. SMBJ are packaged in SMB (SMB footprint in accordance with IPC 7531 standard).

Features

AI Translation
  • Peak pulse power: – 600 W (10/1000 μs) 4 kW (8/20 µs)
  • Stand off voltage range: from 5 V to 188 V
  • Unidirectional and bidirectional types
  • Low leakage current: – 0.2 μA at 25 °C 1 μA at 85 °C
  • Operating Tj max: 150 °C
  • High power capability at Tj max: – 515 W (10/1000 µs) JEDEC registered package outline
  • IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge)
  • IEC 61000-4-5
  • MIL STD 883G, method 3015-7 Class 3B: – 25 kV HBM (human body model)
  • Resin meets UL 94, V0
  • MIL-STD-750, method 2026 soldererability
  • EIA STD RS-481 and IEC 60286-3 packing
  • IPC 7531 footprint