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LITEON LTV-815RoHS

Manufacturer
LITEONAsian Brands
MPN
LTV-815
LCSC Part #
C10801
Packaging
DIP-4
Customer #
Key Attributes
OPTOISOLATOR 5kV 1CH TRANS DIP-4
Datasheetpdf iconLITEON LTV-815
In-Stock: 65
65 In stock, ships now
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QtyUnit PriceTotal Amount
5+$ 0.2545$ 1.27
50+$ 0.2014$ 10.07
200+$ 0.1786$ 35.72
500+$ 0.1503$ 75.15
2,000+$ 0.1376$ 275.20
5,000+$ 0.13$ 650.00
Standard Packaging100/Full Tube
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Products Specifications

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TypeDescription
CategoryIsolators/Optocouplers, Optoisolators/Transistor, Photovoltaic Output Optoisolators
ManufacturerLITEON
PackagingDIP-4
Output Current80mA
Fall time53us
Rise time60us@10mA,100Ω
Vce Saturation(VCE(sat))800mV@20mA,5mA
Load Voltage35V
Reverse Voltage6V
Current transfer ratio600%;7500%
Voltage - Forward(Vf)1.2V
Forward Current(If)50mA
Number of Channels1
Total Power Dissipation(Pd)200mW
Operating Temperature-30℃~+110℃
Output TypePhototransistor
Input typeDC
Isolation Voltage(Vrms)5kV
FeaturesDarlington output structure

Additional Information

TypeDetails
Minimum5
Multiple5
Standard Packaging100
Sales UnitPiece

Features

AI Translation
  • Current transfer ratio ( CTR : MIN. 600% at lF = 1mA, VCE = 2V )
  • High input-output isolation voltage ( Viso = 5,000Vrms )
  • Response time ( tr : TYP. 60μs at VCE = 2V, IC = 10mA, RL = 100Ω )
  • Dual-in-line package : LTV-815 : 1-channel type LTV-825 : 2-channel type LTV-845 : 4-channel type
  • Wide lead spacing package : LTV-815M : 1-channel type LTV-825M : 2-channel type LTV-845M : 4-channel type
  • Surface mounting package : LTV-815S : 1-channel type LTV-825S : 2-channel type LTV-845S : 4-channel type
  • Tape and reel packaging : LTV-815S-TA : 1-channel type LTV-815S-TA1 : 1-channel type LTV-815S-TP : 1-channel type LTV-825S-TA1 : 2-channel type
  • Safety approval UL 1577 VDE DIN EN60747-5-5 (VDE 0884-5) CSA CA5A Nordic Safety ( FIMKO/NEMKO/SEMKO/DEMKO)
  • BSI RoHS Compliance All materials be used in device are followed EU RoHS directive (No.2002/95/E
  • ESD pass HBM 8000V/MM2000V
  • MSL class1

Applications

AI Translation
  • Hybrid substrates that require high density mounting.
  • Programmable controllers