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TI SN74LVC2G04DCKR product image
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TI SN74LVC2G04DCKRRoHS

Manufacturer
TI
MPN
SN74LVC2G04DCKR
LCSC Part #
C105251
Packaging
SOT-363-6
Customer #
Key Attributes
Dual Inverter Gate
Datasheetpdf iconTI SN74LVC2G04DCKR
In-Stock: 1,200
1,200 In stock, ships now
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QtyUnit PriceTotal Amount
5+$ 0.172$ 0.86
50+$ 0.1396$ 6.98
150+$ 0.1234$ 18.51
500+$ 0.1113$ 55.65
3,000+$ 0.0895$ 268.50
6,000+$ 0.0846$ 507.60
Standard Packaging3000/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Logic/Gates and Inverters
ManufacturerTI
PackagingSOT-363-6
Logic Family74LVC
Input Type-
Voltage - Supply1.65V~5.5V
Output Logic Level - Low-
Propagation Delay3.2ns@5V,50pF
FeaturesPower shutdown protection
Operating Temperature-40℃~+125℃
Input Logic Level - Low700mV~800mV
Input Logic Level - High1.7V~2V
Number of Circuits2
Output Logic Level - High-
Quiescent Current(Iq)10uA
Number of Channels2
Current - Output High(IOH)32mA
Current - Output Low(IOL)32mA
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Additional Information

TypeDetails
Minimum5
Multiple5
Standard Packaging3000
Sales UnitPiece

Introduction

AI Translation
  • This dual inverter is designed for 1.65-V to 5.5–V CC operation. The SN74LVC2G04 device performs the Boolean function Y = A̅.
  • NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
  • This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Features

AI Translation
  • Available in the NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.1 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
  • Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22:
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Applications

AI Translation
  • IP Phones: Wired and Wireless
  • Optical Modules
  • Optical Networking: EPON and Video Over Fiber
  • Point-to-Point Microwave Backhaul
  • Power: Telecom DC/DC Module: Analog and Digital
  • Private Branch Exchanges (PBX)
  • TETRA Base Exchanges
  • Telecom Base Band Units
  • Telecom Shelters: Power Distribution Units (PDU), Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted Amplifiers (TMA)
  • Vector Signal Analyzers and Generators
  • Video Converencing: IP-Based HD
  • WiMAX and Wireless Infrastructure Equipment
  • Wireless Communications Testers and Wireless Repeaters
  • xDSL Modems and DSLAM