MACOM MA4P506-255

MACOM's packaged PIN diode product line is extensive, covering a comprehensive range of electrical characteristics and package configurations. The diverse combination of semiconductor technologies and die packaging offers circuit designers significant flexibility. The fast-switching series of packaged PIN diodes feature thin I-region, silicon oxide or glass passivated dies, achieving low leakage current and low insertion loss. By using process control monitors to regulate wafer fabrication parameters, these devices deliver consistent performance in control circuit applications. The high-voltage series of packaged PIN diodes utilizes MACOM's CERMACHIP® passivation process, offering hermetically sealed glass packages that provide airtight sealing and protection of the die's active regions. These packaged CERMACHIP® PIN diodes are ideal for high-power applications where high-level RF voltages are present. The diode dies are housed in hermetic ceramic packages designed for the most demanding electrical and environmental conditions. A wide variety of package styles are available for use in diverse RF and microwave circuits. The packaged PIN diode series is designed with high inherent reliability and can be screened to meet numerous requirements upon request.

• High power
• High speed
• Voltage ratings up to 1500V
• Wide selection of carrier lifetimes
• Wide selection of capacitance
• Multiple package styles
• RoHS compliant

• High-power applications
• RF microwave circuits