Fair-Rite 2508051017Y0

Multilayer chip ferrite beads are designed to suppress conducted EMI signals and are suitable for mobile phones, computers, laptops, pagers, and various other devices. Their compact package size facilitates automated placement and supports high-density PCB assembly. All beads undergo 100% testing for impedance and DC resistance, and are available in standard, high-speed, and gigahertz signal speed versions. These beads are organized by increasing package size and current-carrying capacity. All multilayer chip ferrite beads are supplied in tape-and-reel form; bulk packaging is also available upon request. Listed impedance values are typical; nominal impedance has a ±25% tolerance at the specified 100 MHz frequency. The beads feature 100% matte tin-plated contacts over a nickel underplate, compatible with both reflow and wave soldering processes. The recommended land pattern conforms to the latest revision of IPC-7351. The recommended storage and operating temperature range is -55°C to 125°C. A "Chip Bead Kit" (Part No. 0199000018) is available for prototype evaluation. Impedance, reactance, and resistance vary with frequency. Impedance varies with frequency and DC bias. ∑(i=1→∞) ln A — core constant. Ae: Σ effective cross-sectional area. AL — inductance factor (__LN2). N/AWG — number of turns/wire gauge of the test coil. ¹e: effective path length. Ve: effective core volume. NI — DC ampere-turns value.

• Mobile phones
• Computers
• Laptops
• Pagers