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RENESAS R7FA6T2BD3CFP#BA1

Produttore
Cod. Prod.
R7FA6T2BD3CFP#BA1
Cod. LCSC
C7272313
Imballo
LFQFP-100(14x14)
Numero Cliente
Attr. chiave
ARM Cortex-M33 32 Bit 240MHz LFQFP-100(14x14) Microcontrollers RoHS
Scheda TecnicaRENESAS R7FA6T2BD3CFP#BA1
Parti alternative5
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaIntegrated Circuits (ICs)/Embedded/Microcontrollers
ProduttoreRENESAS
ImballoLFQFP-100(14x14)
DAC (Bit)12bit
ADC (Bit)16bit
Number of I/O84
Operating Temperature-40℃~+105℃
Program Memory TypeFLASH
Voltage - Supply2.7V~3.6V
EEPROM16KB
Program Storage Size512KB
CPU CoreARM Cortex-M33
Core Size32 Bit
CPU Maximum Speed240MHz
Oscillator TypeBuilt-in

Descrizione

Traduzione AI

The R7FA6T2AD3CFM microcontroller integrates a high-performance Arm Cortex-M33 core running at up to 240MHz, with up to 512KB code flash (supporting background operations), 16KB data flash, and 64KB ECC-protected SRAM. Integrated peripherals include ADC, general-purpose PWM timers, and a security cryptography engine. The series employs multiple software-compatible Arm 32-bit cores sharing a common peripheral set, enabling design scalability and platform-based development; some devices within the series implement a subset of the above features.

Caratteristiche

Traduzione AI
  • Armv8-M architecture with Main Extension, max operating frequency: 240MHz
  • Arm Memory Protection Unit (ArmMPU)
  • Protected Memory System Architecture (PMSAv8)
  • Secure MPU (MPU_S): 8 regions
  • Non-secure MPU (MPU_NS): 8 regions
  • SysTick timer
  • Dual embedded SysTick timers: secure and non-secure instances
  • Driven by LOCO or system clock
  • CoreSight ETM-M33
  • Up to 512KB code flash
  • 16KB data flash (125,000 program/erase (P/E) cycles)
  • 64KB SRAM
  • 6 Serial Communication Interfaces (SCI)
  • Asynchronous interface
  • 8-bit clock synchronous interface
  • Smart card interface
  • Simple IIC
  • Simple SPI
  • Simple LIN
  • Manchester encoding
  • 2 I²C bus interfaces (IIC)
  • Up to 3.2Mbps transfer rate (high-speed mode)
  • 2 Serial Peripheral Interfaces (SPI)
  • CAN with Flexible Data Rate (CANFD)
  • 2 A/D converters (ADC)
  • Up to 16-bit resolution
  • Up to 6.25Msps
  • 6 dedicated channel sample-and-hold circuits
  • 4 Programmable Gain Amplifiers (PGA)
  • 4 high-speed analog comparators (ACMPHS)
  • 4 12-bit D/A converters (DAC12)
  • Temperature Sensor (TSN)
  • 4 high-resolution 32-bit general-purpose PWM timers (GPT32)
  • 156ps resolution at 200MHz
  • 6 32-bit general-purpose PWM timers (GPT32)
  • 2 low-power asynchronous general-purpose timers (AGT)
  • Secure Cryptographic Engine (SCE5)
  • Symmetric algorithm: AES
  • Hash generation: GHASH
  • 128-bit unique ID
  • Arm TrustZone
  • Up to three regions in code flash
  • Up to two regions in data flash
  • Up to three regions in SRAM
  • Independent secure or non-secure attributes per peripheral
  • Device lifecycle management
  • Low-power modes
  • Event Link Controller (ELC)
  • Data Transfer Controller (DTC)
  • 8 DMA controllers (DMAC)
  • Power-on reset
  • Low Voltage Detection (LVD) with voltage setting
  • Watchdog Timer (WDT)
  • Independent Watchdog Timer (IWDT)
  • Key Interrupt function (KINT)
  • Trigonometric Function Unit (TFU)
  • IIR Filter Accelerator (IIRFA)
  • Main Clock Oscillator (MOSC) (8 to 24MHz)
  • High-speed On-Chip Oscillator (HOCO) (16/18/20MHz)
  • Medium-speed On-Chip Oscillator (MOCO) (8MHz)
  • Low-speed On-Chip Oscillator (LOCO) (32.768kHz)
  • IWDT-dedicated On-Chip Oscillator (15kHz)
  • HOCO/MOCO/LOCO clock trimming
  • PLL/PLL2
  • Clock output support
  • 5V-tolerant, open-drain, input pull-up, switchable drive strength
  • VCC: 2.7 to 3.6V
  • Operating temperature Ta = -40°C to +105°C