VISHAY SI8401DB-T1-E1
| Producent | |
| Nr części prod. | SI8401DB-T1-E1 |
| Nr LCSC | C7011632 |
| Opak. | XFBGA-4 |
| Numer Klienta | |
| Klucz. cechy | 20V 4.9A 2.77W 65mΩ@4.5V 1 P-Channel XFBGA-4 Single FETs, MOSFETs RoHS |
| Karta Katalogowa | VISHAY SI8401DB-T1-E1 |
| Części alternatywne | 3 |
Specyfikacje Produktu
| Typ | Opis | |
|---|---|---|
| Kategoria | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Producent | VISHAY | |
| Opak. | XFBGA-4 | |
| Operating Temperature | -55℃~+150℃ | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 4.9A | |
| Pd - Power Dissipation | 2.77W | |
| RDS(on) | 65mΩ@4.5V | |
| Number | 1 P-Channel | |
| Gate Charge(Qg) | 17nC@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 1.4V |
| Typ | Opis | |
|---|---|---|
| Kategoria | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Producent | VISHAY | |
| Opak. | XFBGA-4 | |
| Operating Temperature | -55℃~+150℃ | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 4.9A |
| Typ | Opis | |
|---|---|---|
| Pd - Power Dissipation | 2.77W | |
| RDS(on) | 65mΩ@4.5V | |
| Number | 1 P-Channel | |
| Gate Charge(Qg) | 17nC@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 1.4V |
Opis
Vishay Siliconix's MICRO FOOT product family is based on wafer-level chip-scale packaging (WL-CSP) technology, which uses a solder ball process that eliminates the need for an external package to encapsulate the silicon die. The MICRO FOOT product line includes power MOSFETs, analog switches, and power ICs. For compact battery-powered devices, this new packaging technology reduces PCB space requirements, improves thermal performance, and mitigates the parasitic effects commonly associated with leaded packages. Vishay Siliconix MICRO FOOT devices can be handled using the same process technology employed for high-volume SMT assembly of packaged components. With proper attention to PCB and stencil design, these devices achieve reliable performance without underfill. The small footprint and short thermal path make them ideal for space-constrained applications such as portable devices — including battery packs, personal digital assistants, mobile phones, and notebook computers.
Funkcje
- TrenchFET Power MOSFET
- MICRO FOOT chip-scale package reduces footprint profile (0.62 mm) and on-resistance per unit area
- Pin-compatible with industry-standard Si3443DV
Zastosowania
- Power amplifiers, battery and load switches
- Battery charger switches
- Power amplifier switches
| Szt. | Cena jedn.(Tylko do wglądu) | Suma całkowita |
|---|---|---|
| 1+ | $ 1.1639 | $ 1.16 |
| 200+ | $ 0.4653 | $ 93.06 |
| 500+ | $ 0.4501 | $ 225.05 |
| 1,000+ | $ 0.4425 | $ 442.50 |
Standardowa Obudowa3000/Full Reel | ||
Specyfikacje Produktu
| Typ | Opis | |
|---|---|---|
| Kategoria | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Producent | VISHAY | |
| Opak. | XFBGA-4 | |
| Operating Temperature | -55℃~+150℃ | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 4.9A | |
| Pd - Power Dissipation | 2.77W | |
| RDS(on) | 65mΩ@4.5V | |
| Number | 1 P-Channel | |
| Gate Charge(Qg) | 17nC@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 1.4V |
| Typ | Opis | |
|---|---|---|
| Kategoria | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Producent | VISHAY | |
| Opak. | XFBGA-4 | |
| Operating Temperature | -55℃~+150℃ | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 4.9A |
| Typ | Opis | |
|---|---|---|
| Pd - Power Dissipation | 2.77W | |
| RDS(on) | 65mΩ@4.5V | |
| Number | 1 P-Channel | |
| Gate Charge(Qg) | 17nC@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 1.4V |
Opis
Vishay Siliconix's MICRO FOOT product family is based on wafer-level chip-scale packaging (WL-CSP) technology, which uses a solder ball process that eliminates the need for an external package to encapsulate the silicon die. The MICRO FOOT product line includes power MOSFETs, analog switches, and power ICs. For compact battery-powered devices, this new packaging technology reduces PCB space requirements, improves thermal performance, and mitigates the parasitic effects commonly associated with leaded packages. Vishay Siliconix MICRO FOOT devices can be handled using the same process technology employed for high-volume SMT assembly of packaged components. With proper attention to PCB and stencil design, these devices achieve reliable performance without underfill. The small footprint and short thermal path make them ideal for space-constrained applications such as portable devices — including battery packs, personal digital assistants, mobile phones, and notebook computers.
Funkcje
- TrenchFET Power MOSFET
- MICRO FOOT chip-scale package reduces footprint profile (0.62 mm) and on-resistance per unit area
- Pin-compatible with industry-standard Si3443DV
Zastosowania
- Power amplifiers, battery and load switches
- Battery charger switches
- Power amplifier switches
Zgodność & Kody Eksportowe
| Typ | Szczegóły |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |
| Typ | Szczegóły |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| Typ | Szczegóły |
|---|---|
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |
Części alternatywne
| MPN | Producent | Typ alternatywny | Opakowanie | Dostępność | Cena jednostkowa | ||
|---|---|---|---|---|---|---|---|
| SI8487DB-T1-E1 | VISHAY | Podobne | UFBGA-4 | 4,757 | $ 0.3382 | ||
| SI8413DB-T1-E1 | VISHAY | Podobne | XFBGA-4 | 0 | $ 0.209 | ||
| SI8409DB-T1-E1 | VISHAY | Podobne | XFBGA-4 | 0 | $ 1.2684 |