KEMET CKC18C303KDGLC7800

KEMET KC-LINK chip capacitors with KONNEKT technology are designed for high-efficiency, high-density power applications. KONNEKT high-density packaging technology employs an innovative Transient Liquid Phase Sintering (TLPS) material, creating a surface-mount multi-chip solution for high-density packaging. Leveraging KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are ideally suited for power converters, inverters, snubbers, and resonators where high efficiency is required. KONNEKT technology achieves low-loss, low-inductance packaging capable of handling extremely high ripple currents, with no capacitance change versus DC voltage and negligible capacitance change versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast-switching semiconductors in high power density applications with minimal cooling required. Compared to other dielectric technologies, KC-LINK capacitors with KONNEKT technology also offer superior mechanical strength, enabling mounting without the use of a metal frame. These capacitors can also be mounted in the low-loss orientation to further enhance power handling capability. The low-loss orientation reduces ESR and ESL, thereby improving ripple current handling capability.

• Extremely high power density and ripple current handling capability
• Ultra-low ESR
• Ultra-low ESL
• Low-loss orientation option for enhanced current handling capability
• Capacitance range: 14 - 880 nF
• DC voltage rating: 500 - 2000 V
• Operating temperature range: -55°C to +150°C
• Capacitance stable vs. voltage
• No piezoelectric noise
• High thermal stability
• SMT-compatible using standard MLCC reflow soldering process

• Wide Bandgap (WBG), SiC, and GaN systems
• Data centers
• EV/HEV (drive systems, charging)
• LLC resonant converters
• Switched-slot converters
• Wireless charging systems
• Photovoltaic systems
• Power converters
• Inverters
• DC link
• Snubbers