LCSC Electronics logoLCSC Electronics svg logo
Anmelden
USD
RENESAS 8T73S1802NLGI product image
Abbildung ähnlich

RENESAS 8T73S1802NLGI

Hersteller
Herst.-Teilenr.
8T73S1802NLGI
LCSC-Nr.
C3613700
Verp.
VFQFPN-16(3x3)
Kundennummer
Hauptmerkm.
2.375V~3.465V 1GHz 2 VFQFPN-16(3x3) Clock Buffers, Drivers RoHS
DatenblattRENESAS 8T73S1802NLGI
Garantie auf jede Bestellung
100% Authentisch · 30-Tage-Rückgabe oder -Umtausch

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Clock/Timing/Clock Buffers, Drivers
HerstellerRENESAS
Verp.VFQFPN-16(3x3)
Operating Temperature-40℃~+85℃
Voltage - Supply2.375V~3.465V
FeaturesMulti-channel fan-out/isolation drive;Programmable frequency division and inversion control;Output enable/shutdown
Number of Inputs1
Output Frequency(Max)1GHz
Number of outputs2

Beschreibung

KI-Übersetzung

The 8T73S1802 is a fully integrated clock fanout buffer and frequency divider. The input signal is frequency-divided and distributed to one differential LVPECL output and one LVCMOS output. Each output can independently select its division ratio from ÷1, ÷2, ÷4, and ÷8. Three control inputs — EN, SEL0, and SEL1 (tri-state logic) — are used to select the frequency division ratio and enable/disable each output. The single-ended LVCMOS output is phase-delayed by 650ps to minimize coupling from LVCMOS switching to the differential output during signal transitions.

Merkmale

KI-Übersetzung
  • High-performance fanout buffer clock and fanout buffer
  • Input clock signal distributed to one LVPECL output and one LVCMOS output
  • Configurable divider on both LVPECL and LVCMOS outputs
  • Supports clock frequencies up to 1000MHz (LVPECL) and 200MHz (LVCMOS)
  • Flexible differential input supporting LVPECL, LVDS, and CML
  • VBB generator output supports single-ended input signal applications
  • Optimized for low phase noise
  • 650ps delay between LVCMOS and LVPECL minimizes inter-output coupling
  • Supply voltage: 3.3V or 2.5V
  • Operating temperature range: -40℃ to 85℃
  • 16 VFQFPN package (3x3 mm)

Anwendungen

KI-Übersetzung
  • Wireless infrastructure
  • Telecommunications
  • Network terminal equipment