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TI TMS320TCI6482BGTZA

Produttore
Cod. Prod.
TMS320TCI6482BGTZA
Cod. LCSC
C3588369
Imballo
-
Numero Cliente
Attr. chiave
Fixed-point 1GHz DSP (Digital Signal Processors)
Scheda TecnicaTI TMS320TCI6482BGTZA
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Esaurito
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Minimo: 1Multiplo: 1Unità di vendita: Piece
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QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 34.4337$ 34.43
200+$ 13.3259$ 2665.18
500+$ 12.8569$ 6428.45
1,000+$ 12.6256$ 12625.60
Package Standard1/Full Bag
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaIntegrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors)
ProduttoreTI
Imballo-
Operating Temperature-40℃~+105℃
TypeFixed-point
FeaturesHardware MAC acceleration;Parallel data channel;DMA data transfer;High-speed peripheral interface;RTC and timer
Clock Rate1GHz

Descrizione

Traduzione AI

The TMS320C64x+ DSPs (including the TMS320TCI6482 device) are the highest-performance fixedpoint DSP generation in the TMS320C6000 DSP platform. The TCI6482 device is based on the thirdgeneration high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture, making these DSPs an excellent choice for applications including video and telecom infrastructure, imaging/medical, and wireless infrastructure (WI). The C64x+ devices are upward code-compatible from previous devices that are part of the C6000 DSP platform. Based on 90-nm process technology and with performance of up to 9600 million instructions per second (MIPS) [or 9600 16-bit MMACs per cycle] at a 1.2-GHz clock rate, the TCI6482 device offers cost-effective solutions to high-performance DSP programming challenges. The TCI6482 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core employs eight functional units, two register files, and two data paths. Two of these eight functional units are multipliers or .M units. Each C64x+ .M unit doubles the multiply throughput versus the C64x core by performing four 16-bit x 16-bit multiply-accumulates (MACs) every clock cycle. Thus, eight 16-bit x 16-bit MACs can be executed every cycle on the C64x+ core. At a 1.2-GHz clock rate, this means 9600 16-bit MMACs can occur every second. Moreover, each multiplier on the C64x+ core can compute one 32-bit × 32-bit MAC or four 8-bit x 8-bit MACs every clock cycle. The TCI6482 device includes Serial RapidIO. This high bandwidth peripheral dramatically improves system performance and reduces system cost for applications that include multiple DSPs on a board, such as video and telecom infrastructures and medical/imaging. The TCI6482 DSP integrates a large amount of on-chip memory organized as a two-level memory system. The level-1 (L1) program and data memories on the TCI6482 device are 32KB each. This memory can be configured as mapped RAM, cache.

Caratteristiche

Traduzione AI
  • High-Performance Communications Infrastructure DSP (TCI6482) – 1.17-, 1-, and 0.83-ns Instruction Cycle Time – 850-MHz, 1-GHz, and 1.2-GHz Clock Rate – Eight 32-Bit Instructions/Cycle – 9600 MIPS/MMACS (16-Bits) – Commercial Temperature [0℃ to 90℃] – Extended Temperature [-40℃ to 105℃]
  • TMS320C64x+ DSP Core – Dedicated SPLOOP Instruction – Compact Instructions (16-Bit) – Instruction Set Enhancements – Exception Handling
  • TMS320C64x+ Megamodule L1/L2 Memory Architecture: – 256K-Bit (32K-Byte) L1P Program Cache [Direct Mapped] – 256K-Bit (32K-Byte) L1D Data Cache [2-Way Set-Associative] – 16M-Bit (2048K-Byte) L2 Unified Mapped RAM/Cache [Flexible Allocation] – 256K-Bit (32K-Byte) L2 ROM – Time Stamp Counter
  • 2 RSAs for CDMA Processing – Dedicated RAKE, PATH_SEARCH and RACH_SEARCH Instructions – Transmit Processing Capability
  • Enhanced Viterbi Decoder Coprocessor (VCP2) – Supports Over 694 7.95-Kbps AMR – Programmable Code Parameters
  • Enhanced Turbo Decoder Coprocessor (TCP2) – Supports up to Eight 2-Mbps 3GPP (6 Iterations) – Programmable Turbo Code and Decoding Parameters
  • Endianess: Little Endian, Big Endian
  • 64-Bit External Memory Interface (EMIFA) – Glueless Interface to Asynchronous Memories (SRAM, Flash, and EEPROM) and Synchronous Memories (SBSRAM, ZBT SRAM) – Supports Interface to Standard Sync Devices and Custom Logic (FPGA, CPLD, ASICs, etc.) – 32M-Byte Total Addressable External Memory Space
  • Four 1x Serial RapidIO Links (or One 4x), v1.2 Compliant – 1.25-, 2.5-, 3.125-Gbps Link Rates – Message Passing, DirectIO Support, Error Mgmt Extensions, Congestion Control – IEEE 1149.6 Compliant I/Os
  • DDR2 Memory Controller – Interfaces to DDR2-533 SDRAM – 32-Bit/16-Bit, 533-MHz (data rate) Bus – 512M-Byte Total Addressable External Memory Space
  • EDMA3 Controller (64 Independent Channels)
  • 32-/16-Bit Host-Port Interface (HPI)
  • 32-Bit 33-/66-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface Conforms to PCI Local Bus Specification (v2.3)
  • One Inter-Integrated Circuit (I²C) Bus
  • Two McBSPs
  • 10/100/1000 Mb/s Ethernet MAC (EMAC) – IEEE 802.3 Compliant – Supports Multiple Media Independent Interfaces (MII, GMII, RMII, and RGMII) – 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels
  • Two 64-Bit General-Purpose Timers, Configurable as Four 32-Bit Timers
  • UTOPIA – UTOPIA Level 2 Slave ATM Controller – 8-Bit Transmit and Receive Operations up to 50 MHz per Direction – User-Defined Cell Format up to 64 Bytes
  • VLYNQ Port – Full Duplex Serial Bus – Up to 4-Bit Transmit, 4-Bit Receive – Up to 125-MHz Operation
  • 16 General-Purpose I/O (GPIO) Pins
  • System PLL and PLL Controller
  • Secondary PLL and PLL Controller, Dedicated to EMAC and DDR2 Memory Controller
  • Advanced Event Triggering (AET) Compatible
  • Trace-Enabled Device
  • IEEE-1149.1 (JTAG) Boundary-ScanCompatible
  • 697-Pin Ball Grid Array (BGA) Package (CTZ, GTZ, or ZTZ Suffix), 0.8-mm Ball Pitch
  • 0.09-μm/7-Level Cu Metal Process (CMOS)
  • 3.3-/1.8-/1.5-/1.25-/1.2-V I/Os, 1.25-/1.2-V Internal

Applicazioni

Traduzione AI
  • video infrastructure
  • telecom infrastructure
  • imaging/medical
  • wireless infrastructure