TI TMS320TCI6482BGTZA
| Produttore | |
| Cod. Prod. | TMS320TCI6482BGTZA |
| Cod. LCSC | C3588369 |
| Imballo | - |
| Numero Cliente | |
| Attr. chiave | Fixed-point 1GHz DSP (Digital Signal Processors) |
| Scheda Tecnica | TI TMS320TCI6482BGTZA |
Specifiche del Prodotto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| Produttore | TI | |
| Imballo | - | |
| Operating Temperature | -40℃~+105℃ | |
| Type | Fixed-point | |
| Features | Hardware MAC acceleration;Parallel data channel;DMA data transfer;High-speed peripheral interface;RTC and timer | |
| Clock Rate | 1GHz |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| Produttore | TI | |
| Imballo | - | |
| Operating Temperature | -40℃~+105℃ |
| Tipo | Descrizione | |
|---|---|---|
| Type | Fixed-point | |
| Features | Hardware MAC acceleration;Parallel data channel;DMA data transfer;High-speed peripheral interface;RTC and timer | |
| Clock Rate | 1GHz |
Descrizione
The TMS320C64x+ DSPs (including the TMS320TCI6482 device) are the highest-performance fixedpoint DSP generation in the TMS320C6000 DSP platform. The TCI6482 device is based on the thirdgeneration high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture, making these DSPs an excellent choice for applications including video and telecom infrastructure, imaging/medical, and wireless infrastructure (WI). The C64x+ devices are upward code-compatible from previous devices that are part of the C6000 DSP platform. Based on 90-nm process technology and with performance of up to 9600 million instructions per second (MIPS) [or 9600 16-bit MMACs per cycle] at a 1.2-GHz clock rate, the TCI6482 device offers cost-effective solutions to high-performance DSP programming challenges. The TCI6482 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core employs eight functional units, two register files, and two data paths. Two of these eight functional units are multipliers or .M units. Each C64x+ .M unit doubles the multiply throughput versus the C64x core by performing four 16-bit x 16-bit multiply-accumulates (MACs) every clock cycle. Thus, eight 16-bit x 16-bit MACs can be executed every cycle on the C64x+ core. At a 1.2-GHz clock rate, this means 9600 16-bit MMACs can occur every second. Moreover, each multiplier on the C64x+ core can compute one 32-bit × 32-bit MAC or four 8-bit x 8-bit MACs every clock cycle. The TCI6482 device includes Serial RapidIO. This high bandwidth peripheral dramatically improves system performance and reduces system cost for applications that include multiple DSPs on a board, such as video and telecom infrastructures and medical/imaging. The TCI6482 DSP integrates a large amount of on-chip memory organized as a two-level memory system. The level-1 (L1) program and data memories on the TCI6482 device are 32KB each. This memory can be configured as mapped RAM, cache.
Caratteristiche
- High-Performance Communications Infrastructure DSP (TCI6482) – 1.17-, 1-, and 0.83-ns Instruction Cycle Time – 850-MHz, 1-GHz, and 1.2-GHz Clock Rate – Eight 32-Bit Instructions/Cycle – 9600 MIPS/MMACS (16-Bits) – Commercial Temperature [0℃ to 90℃] – Extended Temperature [-40℃ to 105℃]
- TMS320C64x+ DSP Core – Dedicated SPLOOP Instruction – Compact Instructions (16-Bit) – Instruction Set Enhancements – Exception Handling
- TMS320C64x+ Megamodule L1/L2 Memory Architecture: – 256K-Bit (32K-Byte) L1P Program Cache [Direct Mapped] – 256K-Bit (32K-Byte) L1D Data Cache [2-Way Set-Associative] – 16M-Bit (2048K-Byte) L2 Unified Mapped RAM/Cache [Flexible Allocation] – 256K-Bit (32K-Byte) L2 ROM – Time Stamp Counter
- 2 RSAs for CDMA Processing – Dedicated RAKE, PATH_SEARCH and RACH_SEARCH Instructions – Transmit Processing Capability
- Enhanced Viterbi Decoder Coprocessor (VCP2) – Supports Over 694 7.95-Kbps AMR – Programmable Code Parameters
- Enhanced Turbo Decoder Coprocessor (TCP2) – Supports up to Eight 2-Mbps 3GPP (6 Iterations) – Programmable Turbo Code and Decoding Parameters
- Endianess: Little Endian, Big Endian
- 64-Bit External Memory Interface (EMIFA) – Glueless Interface to Asynchronous Memories (SRAM, Flash, and EEPROM) and Synchronous Memories (SBSRAM, ZBT SRAM) – Supports Interface to Standard Sync Devices and Custom Logic (FPGA, CPLD, ASICs, etc.) – 32M-Byte Total Addressable External Memory Space
- Four 1x Serial RapidIO Links (or One 4x), v1.2 Compliant – 1.25-, 2.5-, 3.125-Gbps Link Rates – Message Passing, DirectIO Support, Error Mgmt Extensions, Congestion Control – IEEE 1149.6 Compliant I/Os
- DDR2 Memory Controller – Interfaces to DDR2-533 SDRAM – 32-Bit/16-Bit, 533-MHz (data rate) Bus – 512M-Byte Total Addressable External Memory Space
- EDMA3 Controller (64 Independent Channels)
- 32-/16-Bit Host-Port Interface (HPI)
- 32-Bit 33-/66-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface Conforms to PCI Local Bus Specification (v2.3)
- One Inter-Integrated Circuit (I²C) Bus
- Two McBSPs
- 10/100/1000 Mb/s Ethernet MAC (EMAC) – IEEE 802.3 Compliant – Supports Multiple Media Independent Interfaces (MII, GMII, RMII, and RGMII) – 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels
- Two 64-Bit General-Purpose Timers, Configurable as Four 32-Bit Timers
- UTOPIA – UTOPIA Level 2 Slave ATM Controller – 8-Bit Transmit and Receive Operations up to 50 MHz per Direction – User-Defined Cell Format up to 64 Bytes
- VLYNQ Port – Full Duplex Serial Bus – Up to 4-Bit Transmit, 4-Bit Receive – Up to 125-MHz Operation
- 16 General-Purpose I/O (GPIO) Pins
- System PLL and PLL Controller
- Secondary PLL and PLL Controller, Dedicated to EMAC and DDR2 Memory Controller
- Advanced Event Triggering (AET) Compatible
- Trace-Enabled Device
- IEEE-1149.1 (JTAG) Boundary-ScanCompatible
- 697-Pin Ball Grid Array (BGA) Package (CTZ, GTZ, or ZTZ Suffix), 0.8-mm Ball Pitch
- 0.09-μm/7-Level Cu Metal Process (CMOS)
- 3.3-/1.8-/1.5-/1.25-/1.2-V I/Os, 1.25-/1.2-V Internal
Applicazioni
- video infrastructure
- telecom infrastructure
- imaging/medical
- wireless infrastructure
| Qtà | Pr. unit.(Solo per riferimento) | Importo totale |
|---|---|---|
| 1+ | $ 34.4337 | $ 34.43 |
| 200+ | $ 13.3259 | $ 2665.18 |
| 500+ | $ 12.8569 | $ 6428.45 |
| 1,000+ | $ 12.6256 | $ 12625.60 |
Package Standard1/Full Bag | ||
Specifiche del Prodotto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| Produttore | TI | |
| Imballo | - | |
| Operating Temperature | -40℃~+105℃ | |
| Type | Fixed-point | |
| Features | Hardware MAC acceleration;Parallel data channel;DMA data transfer;High-speed peripheral interface;RTC and timer | |
| Clock Rate | 1GHz |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| Produttore | TI | |
| Imballo | - | |
| Operating Temperature | -40℃~+105℃ |
| Tipo | Descrizione | |
|---|---|---|
| Type | Fixed-point | |
| Features | Hardware MAC acceleration;Parallel data channel;DMA data transfer;High-speed peripheral interface;RTC and timer | |
| Clock Rate | 1GHz |
Descrizione
The TMS320C64x+ DSPs (including the TMS320TCI6482 device) are the highest-performance fixedpoint DSP generation in the TMS320C6000 DSP platform. The TCI6482 device is based on the thirdgeneration high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture, making these DSPs an excellent choice for applications including video and telecom infrastructure, imaging/medical, and wireless infrastructure (WI). The C64x+ devices are upward code-compatible from previous devices that are part of the C6000 DSP platform. Based on 90-nm process technology and with performance of up to 9600 million instructions per second (MIPS) [or 9600 16-bit MMACs per cycle] at a 1.2-GHz clock rate, the TCI6482 device offers cost-effective solutions to high-performance DSP programming challenges. The TCI6482 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core employs eight functional units, two register files, and two data paths. Two of these eight functional units are multipliers or .M units. Each C64x+ .M unit doubles the multiply throughput versus the C64x core by performing four 16-bit x 16-bit multiply-accumulates (MACs) every clock cycle. Thus, eight 16-bit x 16-bit MACs can be executed every cycle on the C64x+ core. At a 1.2-GHz clock rate, this means 9600 16-bit MMACs can occur every second. Moreover, each multiplier on the C64x+ core can compute one 32-bit × 32-bit MAC or four 8-bit x 8-bit MACs every clock cycle. The TCI6482 device includes Serial RapidIO. This high bandwidth peripheral dramatically improves system performance and reduces system cost for applications that include multiple DSPs on a board, such as video and telecom infrastructures and medical/imaging. The TCI6482 DSP integrates a large amount of on-chip memory organized as a two-level memory system. The level-1 (L1) program and data memories on the TCI6482 device are 32KB each. This memory can be configured as mapped RAM, cache.
Caratteristiche
- High-Performance Communications Infrastructure DSP (TCI6482) – 1.17-, 1-, and 0.83-ns Instruction Cycle Time – 850-MHz, 1-GHz, and 1.2-GHz Clock Rate – Eight 32-Bit Instructions/Cycle – 9600 MIPS/MMACS (16-Bits) – Commercial Temperature [0℃ to 90℃] – Extended Temperature [-40℃ to 105℃]
- TMS320C64x+ DSP Core – Dedicated SPLOOP Instruction – Compact Instructions (16-Bit) – Instruction Set Enhancements – Exception Handling
- TMS320C64x+ Megamodule L1/L2 Memory Architecture: – 256K-Bit (32K-Byte) L1P Program Cache [Direct Mapped] – 256K-Bit (32K-Byte) L1D Data Cache [2-Way Set-Associative] – 16M-Bit (2048K-Byte) L2 Unified Mapped RAM/Cache [Flexible Allocation] – 256K-Bit (32K-Byte) L2 ROM – Time Stamp Counter
- 2 RSAs for CDMA Processing – Dedicated RAKE, PATH_SEARCH and RACH_SEARCH Instructions – Transmit Processing Capability
- Enhanced Viterbi Decoder Coprocessor (VCP2) – Supports Over 694 7.95-Kbps AMR – Programmable Code Parameters
- Enhanced Turbo Decoder Coprocessor (TCP2) – Supports up to Eight 2-Mbps 3GPP (6 Iterations) – Programmable Turbo Code and Decoding Parameters
- Endianess: Little Endian, Big Endian
- 64-Bit External Memory Interface (EMIFA) – Glueless Interface to Asynchronous Memories (SRAM, Flash, and EEPROM) and Synchronous Memories (SBSRAM, ZBT SRAM) – Supports Interface to Standard Sync Devices and Custom Logic (FPGA, CPLD, ASICs, etc.) – 32M-Byte Total Addressable External Memory Space
- Four 1x Serial RapidIO Links (or One 4x), v1.2 Compliant – 1.25-, 2.5-, 3.125-Gbps Link Rates – Message Passing, DirectIO Support, Error Mgmt Extensions, Congestion Control – IEEE 1149.6 Compliant I/Os
- DDR2 Memory Controller – Interfaces to DDR2-533 SDRAM – 32-Bit/16-Bit, 533-MHz (data rate) Bus – 512M-Byte Total Addressable External Memory Space
- EDMA3 Controller (64 Independent Channels)
- 32-/16-Bit Host-Port Interface (HPI)
- 32-Bit 33-/66-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface Conforms to PCI Local Bus Specification (v2.3)
- One Inter-Integrated Circuit (I²C) Bus
- Two McBSPs
- 10/100/1000 Mb/s Ethernet MAC (EMAC) – IEEE 802.3 Compliant – Supports Multiple Media Independent Interfaces (MII, GMII, RMII, and RGMII) – 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels
- Two 64-Bit General-Purpose Timers, Configurable as Four 32-Bit Timers
- UTOPIA – UTOPIA Level 2 Slave ATM Controller – 8-Bit Transmit and Receive Operations up to 50 MHz per Direction – User-Defined Cell Format up to 64 Bytes
- VLYNQ Port – Full Duplex Serial Bus – Up to 4-Bit Transmit, 4-Bit Receive – Up to 125-MHz Operation
- 16 General-Purpose I/O (GPIO) Pins
- System PLL and PLL Controller
- Secondary PLL and PLL Controller, Dedicated to EMAC and DDR2 Memory Controller
- Advanced Event Triggering (AET) Compatible
- Trace-Enabled Device
- IEEE-1149.1 (JTAG) Boundary-ScanCompatible
- 697-Pin Ball Grid Array (BGA) Package (CTZ, GTZ, or ZTZ Suffix), 0.8-mm Ball Pitch
- 0.09-μm/7-Level Cu Metal Process (CMOS)
- 3.3-/1.8-/1.5-/1.25-/1.2-V I/Os, 1.25-/1.2-V Internal
Applicazioni
- video infrastructure
- telecom infrastructure
- imaging/medical
- wireless infrastructure
Conformità & Codici di Esportazione
| Tipo | Dettagli |
|---|---|
| ECCN | 3A991A2 |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Tipo | Dettagli |
|---|---|
| ECCN | 3A991A2 |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC |
| Tipo | Dettagli |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |

