TI SN74ABT241ADBR

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT240, SN74ABT240A, and ’ABT244A, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE(overline)) inputs, and complementary OE and OE inputs.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

• State-of-the-Art EPIC-IIB BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (ΔC = 200 pF, R = 0)
• Typical vOLP (Output Ground Bounce) < 1 V at Vcc = 5 V, TA = 25℃
• High-Drive Outputs (-32 mA I0H, 64 mA I0L)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package