RENESAS R7FA6M5AH3CFB#AA0

The MCU integrates multiple series of software- and pin-compatible Arm -based 32-bit cores that share a common set of Renesas peripherals to facilitate design scalability and efficient platform-based product development. The MCU in this series incorporates a high-performance Arm Cortex®-M33 core running up to 200 MHz with the following features:

• Up to 2 MB code flash memory
• 512 KB SRAM Quad Serial Peripheral Interface (QSPI), Octa Serial Peripheral Interface (OSPI)
• Ethernet MAC Controller (ETHERC), USBFS, USBHS, SD/MMC Host Interface
• Capacitive Touch Sensing Unit (CTSU)
• Analog peripherals
• Security and safety features

• Armv8-M architecture with the main extension
• Maximum operating frequency: 200 MHz
• Arm Memory Protection Unit (Arm MPU) – Protected Memory System Architecture (PMSAv8) – Secure MPU (MPU_S): 8 regions – Non-secure MPU (MPU_NS): 8 regions
• SysTick timer – Embeds two Systick timers: Secure and Non-secure instance – Driven by LOCO or system clock
• CoreSight™ ETM-M33
• Up to 2-MB code flash memory
• 8-KB data flash memory (100,000 program/erase (P/E) cycles)
• 512-KB SRAM
• Serial Communications Interface (SCI)×10 – Asynchronous interfaces – 8-bit clock synchronous interface – Smart card interface – Simple IIC – Simple SPI – Manchester coding (SCI3, SCI4)
• I²C bus interface (IIC)×3
• Serial Peripheral Interface (SPI)×2
• Quad Serial Peripheral Interface (QSPI)
• Octa Serial Peripheral Interface (OSPI)
• USB 2.0 Full-Speed Module (USBFS)
• USB 2.0 High-Speed Module (USBHS)
• CAN with Flexible Data-rate (CANFD)×2
• Ethernet MAC/DMA Controller (ETHERC/EDMAC)
• SD/MMC Host Interface (SDHI)
• Serial Sound Interface Enhanced (SSIE)
• Consumer Electronics Control (CEC)
• 12-bit A/D Converter (ADC12)×2 – 5 Msps at interleaving
• 12-bit D/A Converter (DAC12)×2
• Temperature Sensor (TSN)
• General PWM Timer 32-bit (GPT32)×4
• General PWM Timer 16-bit (GPTl6)×6
• Low Power Asynchronous General Purpose Timer (AGT)×6
• Realtime Clock (RTC) with calendar and VBATT support
• Event Link Controller (ELC)
• Data Transfer Controller (DTC)
• DMA Controller (DMAC) × 8
• Power-on reset
• Low Voltage Detection (LVD) with voltage settings
• Watchdog Timer (WDT)
• Independent Watchdog Timer (IWDT)
• Capacitive Touch Sensing Unit (CTSU)
• Main clock oscillator (MOSC) (8 to 24 MHz)
• Sub-clock oscillator (SOSC) (32.768 kHz)
• High-speed on-chip oscillator (HOCO) (16/18/20 MHz)
• Middle-speed on-chip oscillator (MOCO) (8 MHz)
• Low-speed on-chip oscillator (LOCO) (32.768 kHz)
• IWDT-dedicated on-chip oscillator (15 kHz)
• Clock trim function for HOCO/MOCO/LOCO
• PLL/PLL2
• Clock out support
• 5-V tolerance, open drain, input pull-up, switchable driving ability
• VCC: 2.7 to 3.6 V
• Ta=-40℃ to +105℃ – 176-pin LQFP (24 mm×24 mm, 0.5 mm pitch) – 144-pin LQFP (20 mm×20 mm, 0.5 mm pitch) – 100-pin LQFP (14 mm×14 mm, 0.5 mm pitch) – 144-pin BGA (7 mm×7 mm, 0.5 mm pitch)
• Ta=-40℃ to +85℃ – 176-pin BGA (13 mm×13 mm, 0.8 mm pitch)