Knowles SBSGP5000152MXB

C-type and Pi-type filters are mounted and soldered to the PCB in the same manner as chip capacitors. Solder joints connect to each end (signal line) and each side (ground rail). SBSG, SBSM and SBSP filters can be mounted conventionally on a PCB, or installed in a board wall or bulkhead, which significantly improves shielding between the filter input and output, thereby enhancing high-frequency performance. The following insertion loss curves based on actual measurements (for SBSP, SBSG, SBSM Pi-type filters) demonstrate this effect. It can be seen that conventionally mounted filters (Figure 1) show reduced attenuation at higher frequencies. The improved shielding method (Figure 2) maintains excellent suppression characteristics at 1GHz and above. Surface mount EMI filters — Insertion loss performance of C-type filters was measured in a 50Ω system on an open circuit board mounted on a brass backplane. Performance curves are available on request. In-circuit performance may vary depending on PCB material, trace layout, grounding effectiveness, and circuit impedance. Shielding may be used to improve high-frequency performance. Surface mount EMI filters — Insertion loss performance of Pi-type filters was measured in a 50Ω system on an open FR4 circuit board mounted on a brass backplane. Performance curves are available on request. In-circuit performance may vary depending on PCB material, trace layout, grounding effectiveness, and circuit impedance. Shielding may be used to improve high-frequency performance. The soldering process should be controlled so that filters are not subjected to any thermal shock that could cause heat cracking in the ceramic dielectric. The preheat ramp rate should be maintained at approximately 2℃ per second. In practice, successful ramp rates typically range from 1.5℃ to 4℃ per second, depending on the substrate and components. A soak period after preheating helps to equalize substrate temperature, thereby preventing substrate warping. Any degree or change in direction of warping during cooling may impose damaging stress on the filters. E01, E03, E07 SBSP series are compatible with all standard solder types including lead-free solder, with a maximum temperature of 260℃. For SBSG, SBSM and SFSS series, soldering time should be minimized with temperature controlled to a maximum of 220℃. For SFSR, SFST and SFSU series, the maximum temperature is 250℃. Filters should be allowed to cool naturally to ambient temperature. Natural cooling allows thermal mismatch stresses in the solder joints to relax gradually; ventilation should be avoided. Forced air cooling may cause thermal cracking, and cleaning with cold fluid immediately after soldering may cause filter cracking. Soldering iron tip temperature should not exceed 300℃. Dwell time should be a maximum of 3–5 seconds to minimize the risk of capacitor cracking due to thermal shock. Where possible, a heat sink should be used between the solder joint and the body, particularly where longer dwell times are required. Bending or cutting of filter terminals should not be performed within 4mm (0.157 inches) of the epoxy body, and leads should be supported during cutting.