LCSC Electronics logoLCSC Electronics svg logo
Accedi
USD
Nexperia BUK9Y1R6-40H,115 product image
Immagini a scopo illustrativo

Nexperia BUK9Y1R6-40H,115

Produttore
Cod. Prod.
BUK9Y1R6-40H,115
Cod. LCSC
C5581522
Imballo
-
Numero Cliente
Attr. chiave
294W 43V 120A 1.23mΩ@10V 1 N-channel N-Channel Single FETs, MOSFETs
Scheda TecnicaNexperia BUK9Y1R6-40H,115
Garanzia su ogni ordine
100% Autentico · Reso o Sostituzione entro 30 Giorni
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 2.6473$ 2.65
200+$ 1.0562$ 211.24
500+$ 1.0214$ 510.70
1,000+$ 1.0047$ 1004.70
Package Standard1/Full Bag
Prezzo migliore per quantità maggiore?
$

Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaDiscrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs
ProduttoreNexperia
Imballo-
Output Capacitance(Coss)1.022nF
Ciss-Input Capacitance5.402nF
Pd - Power Dissipation294W
Configuration-
Drain to Source Voltage43V
Operating Temperature-55℃~+175℃
Current - Continuous Drain(Id)120A
Reverse Transfer Capacitance (Crss)208pF
RDS(on)1.23mΩ@10V
Number1 N-channel
Gate Charge(Qg)77nC
Vgs-
Gate Threshold Voltage (Vgs(th))1.62V
TypeN-Channel

Descrizione

Traduzione AI

Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a robust LFPAK56 package. This product has been fully designed and qualified to meet AEC-Q101 requirements delivering high performance and endurance.

Caratteristiche

Traduzione AI
  • Reduced cell pitch enables enhanced power density and efficiency with lower Rson in same footprint
  • Improved SOA and avalanche capability compared to standard TrenchMOS
  • Tight VGS(th) limits enable easy paralleling of MOSFETs
  • LFPAK Gull Wing leads:
    • High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages
    • Visual (AOI) soldering inspection, no need for expensive x-ray equipment
    • Easy solder wetting for good mechanical solder joint
  • LFPAK copper clip technology:
    • Improved reliability, with reduced Rth and RDSon
    • Increases maximum current capability and improved current spreading

Applicazioni

Traduzione AI
  • 12 V automotive systems
  • Motors, lamps and solenoid control
  • Start-Stop micro-hybrid applications
  • Transmission control
  • Ultra high performance power switching