TE Connectivity 1-2212115-4

The next-generation multi-beam card edge connectors deliver optimal overall power and signal density to meet server market requirements for performance, form factor, and cost. These connectors are also suited for global datacom applications to reduce costs. Representing the next generation of the current SEC-II power card edge product line, these connectors provide superior current and signal density through a unique design. The scalable and modular architecture also supports greater flexibility in configuration and PCB design.

• High density: highest signal density on the market, saving 60% signal space; 30% higher power density compared to previous products; finer pitch with 1.00mm signal pitch and 7.26mm power pitch; larger power contacts up to 43A
• Improved mating tolerance: better floatability in blind-mate applications, ±2.0mm (X), ±1.54mm (Y); wider gaps between PCB pads for signal contacts to prevent solder bridging, with 1.3mm larger pads for easier alignment; supports two PCB thicknesses, 1.57mm and 2.36mm
• Modular design: universal power and signal contact modules; flexible configuration of contact quantities and positions; enhanced scalability (AC and DC, low power and high power)
• Superior performance: excellent mechanical and electrical performance; easy mating and unmating with appropriate retention force; low-level contact resistance

• Data Centers
• Telecommunications
• Industrial Automation Equipment
• Power Systems