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TI 5962-9559001QXA

Hersteller
Herst.-Teilenr.
5962-9559001QXA
LCSC-Nr.
C3213368
Verp.
-
Kundennummer
Hauptmerkm.
SN54ABT16640, SN74ABT16640 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS
DatenblattTI 5962-9559001QXA
Garantie auf jede Bestellung
100% Authentisch · 30-Tage-Rückgabe oder -Umtausch
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 54.2371$ 54.24
200+$ 20.9891$ 4197.82
500+$ 20.2516$ 10125.80
1,000+$ 19.8874$ 19887.40
Standardgehäuse1/Full Bag
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Logic/Buffers, Drivers, Receivers, Transceivers
HerstellerTI
Verp.-
FunctionEnable/shutdown function
Voltage - Supply4.5V~5.5V
Data Rate-
Interface-
Operating Temperature-55℃~+125℃
Quiescent Supply Current-
Current - Supply-

Beschreibung

KI-Übersetzung

The ABT16640 is an inverting 16-bit transceiver designed for asynchronous communication between data buses. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. Depending on the logic levels of the direction control (1DIR and 2DIR) inputs, it allows data transfer from bus A to bus B, or from bus B to bus A. The output enable (1OE and 2OE) inputs can be used to disable the device, effectively isolating the buses. To ensure a high-impedance state during power-up or power-down, OE should be connected to VCC through a pull-up resistor; the minimum resistor value is determined by the sink current capability of the driver. The SN54ABT16640 operates over a temperature range of -55℃ to 125℃. The SN74ABT16640 operates over a temperature range of -40℃ to 85℃.

Merkmale

KI-Übersetzung
  • Advanced EPIC-IIB BiCMOS design for significantly reduced power consumption
  • Latch-up performance meets JEDEC standard JESD-17, exceeding 500 mA
  • Typical vOLP (output ground bounce) < 1 V at Vcc = 5 V, TA = 25℃
  • Distributed Vcc and GND pin configuration minimizes high-speed switching noise
  • Flow-through architecture optimizes PCB layout
  • High-drive outputs (–32 mA IOH, 64 mA IOL)
  • Package options include 300 mil plastic shrink small-outline (DL) and thin shrink small-outline (DGG) packages, plus 380 mil fine-pitch ceramic flat (WD) package with 25 mil center-to-center spacing

Anwendungen

KI-Übersetzung
  • Between data buses for asynchronous communication
  • As two 8-bit transceivers or one 16-bit transceiver
  • Data transfer from Bus A to Bus B or from Bus B to Bus A
  • Data transfer direction controlled by direction control inputs (1DIR and 2DIR)
  • Output enable inputs (1OE and 2OE) can disable the device, effectively isolating the buses