Flexxon FEMC002GTTG7-T24-17

FLEXXON Enterprise SSD is built with the latest 96L/112L 3D TLC NAND and professional enterprise controller. It delivers superior performance with sequential Read/Write performance up to 7500MB/s, 6000MB/s and random R/W speeds up to 1800K/480K IOPS respectively. Moreover, FLEXXON Enterprise NVMe SSD provides significantly high capacity up to 15.36TB which is an ideal solution for data center and enterprise applications. FLEXXON's Parallel ATA (PATA) is suitable for embedded systems or legacy platforms available in various form factors such as 2.5″ SSD, PATA DOM (40pin & 44pin) and Compact Flash (CF) card, supports latest CF 6.0 version and Ultra DMA mode up to 7, wide compatibility and high reliability. Designed to satisfy specific application requirements for rigorous industrial environments it extends high performance, power loss management and AES encryption. FLEXXON Industrial USB flash drives offer USB 3.2 Gen 1 and USB 2.0 and are designed with high-quality 2D and 3D NAND technology. It is implemented with flash block management, superior wear-leveling, and a powerful ECC engine to increase data reliability and endurance, fulfill commercial and industrial applications. The industrial-grade USB flash drives provide high performance both in sequential and random read/write, cater to specific requirements. Besides, FLEXXON provides security solutions to achieve different level data protection to prevent data breach into these SLC flash drives & MLC USB Flash. It is equipped with a hardware encryption engine and security software embedded to safeguard the data in the USB drive. Pre-loaded data integrity in reflow process: Data integrity refers to the reliability and accuracy of data. The eMMC pre-loaded data might get corrupted during soldering. Flexxon eMMC uses pSLC blocks only during soldering process to ensure no data loss during reflow. Auto Read Refresh: Auto Read Refresh could monitor the bit errors in every read operation. This is important for read-intensive applications. In order to prevent data damage, refresh operation will be triggered when the bit errors are approaching the threshold. Static and Dynamic Wear Leveling: Flexxon eMMC supports static and dynamic wear leveling. The static wear levelling is able to shif cold data (system data that seldom updated) to the block of the maximum erase count in the data area. The dynamic wear leveling shifts hot data (updated user data) to the block of the minimum erase count in the data area. This could reduce the risk of read disturb and sustains data integrity. Power Loss Protection: Flexxon eMMC supports pSLC Area Backup Technology. Partial NAND is enabled as pSLC to backup data. The pSLC area is non-volatile storage which can provide higher read/write performance, endurance and data reliability. Flexxon eMMC supports UECC handling. If sudden power loss happened, uncorrectable ECC could be found in a programmed page. Flexxon eMMC will scan the whole system blocks. Once ECC Uncorrectable or higher ECC error bit is found, those pages will be discarded and move other valid data to a health block. Flexxon eMMC also supports power off notification to provide sufficient time for the device to backup all the cache data. UECC may occur during power interrupted writes, due to pair page issue of MLC. FW moves the valid data before UECC page to new block, minimizing data loss. For special or customized OS, it could optimize wear leveling.