ISSI IS61DDP2B22M36A-400M3L
| Hersteller | ISSIAsian Brands |
| Herst.-Teilenr. | IS61DDP2B22M36A-400M3L |
| LCSC-Nr. | C1353465 |
| Verp. | FBGA-165(15x17) |
| Kundennummer | |
| Hauptmerkm. | 72Mbit Parallel Port (Parallel) FBGA-165(15x17) Memory RoHS |
| Datenblatt | ISSI IS61DDP2B22M36A-400M3L |
| RoHS-Konformität | 1 Dokumente verfügbar |
| Alternativteile | 5 |
Produktspezifikationen
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ISSI | |
| Verp. | FBGA-165(15x17) | |
| Operating Temperature | 0℃~+70℃ | |
| Features | Built-in delay-locked loop;Boundary scan (JTAG) function | |
| Memory Size | 72Mbit | |
| Voltage - Supply | 1.71V~1.89V;750mA | |
| Access Time | - | |
| Standby Supply Current | 420mA | |
| Interface | Parallel Port (Parallel) |
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ISSI | |
| Verp. | FBGA-165(15x17) | |
| Operating Temperature | 0℃~+70℃ | |
| Features | Built-in delay-locked loop;Boundary scan (JTAG) function |
| Typ | Beschreibung | |
|---|---|---|
| Memory Size | 72Mbit | |
| Voltage - Supply | 1.71V~1.89V;750mA | |
| Access Time | - | |
| Standby Supply Current | 420mA | |
| Interface | Parallel Port (Parallel) |
Beschreibung
The 72Mb IS61DDP2B22M36A/A1/A2 and IS61DDP2B24M18A/A1/A2 are synchronous, highperformance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed.
The following are registered internally on the rising edge of the K clock:
- Read/write address
- Read enable
- Write enable
- Byte writes
- Data-in for first burst address
- Data-Out for first burst address
The following are registered on the rising edge of the K# clock:
- Byte writes
- Data-in for second burst address
- Data-Out for second burst address
Byte writes can change with the corresponding data-in to enable or disable writes on a per-byte basis. An internal write buffer enables the data-ins to be registered one cycle after the write address. The first data-in burst is clocked one cycle later than the write command signal, and the second burst is timed to the following rising edge of the K# clock.
During the burst read operation, the data-outs from the first bursts are updated from output registers of the third rising edge of the K clock (starting two clock cycles later after read command). The data-outs from the second burst are updated with the third rising edge of the K# clock where read command receives at the first rising edge of K.
The device is operated with a single +1.8V power supply and is compatible with HSTL I/O interfaces.
Merkmale
- 2Mx36 and 4Mx18 configuration available.
- On-chip Delay-Locked Loop (DLL) for wide data valid window.
- Common I/O read and write ports.
- Synchronous pipeline read with self-timed late write operation.
- Double Data Rate (DDR) interface for read and write input ports.
- 2.0 cycle read latency.
- Fixed 2-bit burst for read and write operations.
- Clock stop support.
- Two input clocks (K and K#) for address and control registering at rising edges only.
- Two echo clocks (CQ and CQ#) that are delivered simultaneously with data.
- +1.8V core power supply and 1.5, 1.8V VDDQ, used with 0.75, 0.9V VREF.
- HSTL input and output interface.
- Registered addresses, write and read controls, byte writes, data in, and data outputs.
- Full data coherency.
- Boundary scan using limited set of JTAG 1149.1 functions.
- Byte write capability.
- Fine ball grid array (FBGA) package: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
- Programmable impedance output drivers via 5x user-supplied precision resistor.
- Data Valid Pin (QVLD).
- ODT (On Die Termination) feature is supported optionally on data input, K/K#, and BWx#.
Produktspezifikationen
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ISSI | |
| Verp. | FBGA-165(15x17) | |
| Operating Temperature | 0℃~+70℃ | |
| Features | Built-in delay-locked loop;Boundary scan (JTAG) function | |
| Memory Size | 72Mbit | |
| Voltage - Supply | 1.71V~1.89V;750mA | |
| Access Time | - | |
| Standby Supply Current | 420mA | |
| Interface | Parallel Port (Parallel) |
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ISSI | |
| Verp. | FBGA-165(15x17) | |
| Operating Temperature | 0℃~+70℃ | |
| Features | Built-in delay-locked loop;Boundary scan (JTAG) function |
| Typ | Beschreibung | |
|---|---|---|
| Memory Size | 72Mbit | |
| Voltage - Supply | 1.71V~1.89V;750mA | |
| Access Time | - | |
| Standby Supply Current | 420mA | |
| Interface | Parallel Port (Parallel) |
Beschreibung
The 72Mb IS61DDP2B22M36A/A1/A2 and IS61DDP2B24M18A/A1/A2 are synchronous, highperformance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed.
The following are registered internally on the rising edge of the K clock:
- Read/write address
- Read enable
- Write enable
- Byte writes
- Data-in for first burst address
- Data-Out for first burst address
The following are registered on the rising edge of the K# clock:
- Byte writes
- Data-in for second burst address
- Data-Out for second burst address
Byte writes can change with the corresponding data-in to enable or disable writes on a per-byte basis. An internal write buffer enables the data-ins to be registered one cycle after the write address. The first data-in burst is clocked one cycle later than the write command signal, and the second burst is timed to the following rising edge of the K# clock.
During the burst read operation, the data-outs from the first bursts are updated from output registers of the third rising edge of the K clock (starting two clock cycles later after read command). The data-outs from the second burst are updated with the third rising edge of the K# clock where read command receives at the first rising edge of K.
The device is operated with a single +1.8V power supply and is compatible with HSTL I/O interfaces.
Merkmale
- 2Mx36 and 4Mx18 configuration available.
- On-chip Delay-Locked Loop (DLL) for wide data valid window.
- Common I/O read and write ports.
- Synchronous pipeline read with self-timed late write operation.
- Double Data Rate (DDR) interface for read and write input ports.
- 2.0 cycle read latency.
- Fixed 2-bit burst for read and write operations.
- Clock stop support.
- Two input clocks (K and K#) for address and control registering at rising edges only.
- Two echo clocks (CQ and CQ#) that are delivered simultaneously with data.
- +1.8V core power supply and 1.5, 1.8V VDDQ, used with 0.75, 0.9V VREF.
- HSTL input and output interface.
- Registered addresses, write and read controls, byte writes, data in, and data outputs.
- Full data coherency.
- Boundary scan using limited set of JTAG 1149.1 functions.
- Byte write capability.
- Fine ball grid array (FBGA) package: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
- Programmable impedance output drivers via 5x user-supplied precision resistor.
- Data Valid Pin (QVLD).
- ODT (On Die Termination) feature is supported optionally on data input, K/K#, and BWx#.
C1353465 EasyEDA-Bibliothek
Compliance & Exportcodes
| Typ | Details |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | 3A991B2A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Typ | Details |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | 3A991B2A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Typ | Details |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |

