{"id":4334,"date":"2026-06-30T07:13:05","date_gmt":"2026-06-30T07:13:05","guid":{"rendered":"https:\/\/blogs.lcsc.com\/blog\/?p=4334"},"modified":"2026-06-30T07:13:05","modified_gmt":"2026-06-30T07:13:05","slug":"ic-basics-explained-how-do-integrated-circuits-work","status":"publish","type":"post","link":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/","title":{"rendered":"IC Basics Explained: How Do Integrated Circuits Work?"},"content":{"rendered":"<p><span data-font-family=\"Google Sans\">An integrated circuit (IC) is a complete electronic circuit. It integrates transistors, resistors, capacitors, and wiring onto a single piece of semiconductor material, usually silicon. Today, a modern IC packs millions or billions of transistors onto a chip just a few millimeters wide. Consequently, it can switch signals billions of times per second to perform logic or shape analog waveforms.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">However, the real story behind this definition is much deeper. It explains how a flat piece of sand becomes a powerful processor. This journey spans crystal growth, photolithography, and transistor physics. Furthermore, it involves critical packaging decisions that affect every subsequent PCB design. Here is how it all fits together.<\/span><\/p>\n<h2><b><span data-font-family=\"Google Sans\">Key Takeaways<\/span><\/b><b><span data-font-family=\"Google Sans\"> \u2014 How Integrated Circuits<\/span><\/b><b><span data-font-family=\"Google Sans\">(<\/span><\/b><b><span data-font-family=\"Google Sans\">IC<\/span><\/b><b><span data-font-family=\"Google Sans\">) <\/span><\/b><b><span data-font-family=\"Google Sans\">Work<\/span><\/b><\/h2>\n<ul>\n<li><span data-font-family=\"Google Sans\">An IC builds millions to billions of components onto one piece of silicon. Therefore, it avoids the need to wire separate parts together.<\/span><\/li>\n<li><span data-font-family=\"Google Sans\">The fabrication process grows a pure silicon crystal and slices it into wafers. After that, workers build up to 30+ patterned layers using photolithography, etching, and doping.<\/span><\/li>\n<li><span data-font-family=\"Google Sans\">Most digital ICs work by switching CMOS transistors on and off in combinations called logic gates. In contrast, analog ICs shape continuous voltage and current.<\/span><\/li>\n<li><span data-font-family=\"Google Sans\">Engineers classify ICs by signal type, such as digital, analog, or mixed-signal. Then, they package them into forms like DIP, SOIC, QFN, or BGA based on pin count, size, and thermal needs.<\/span><\/li>\n<li><span data-font-family=\"Google Sans\">In 2026, leading-edge progress is shifting toward chiplet packaging. This happens because gains per new node are slowing down while wafer costs rise.<\/span><\/li>\n<\/ul>\n<h2><a href=\"https:\/\/blogs.lcsc.com\/blog\/electrical-circuit-design-the-engineers-guide-to-components-specs-layout\/\"><b><span data-font-family=\"Google Sans\">What Is an Integrated Circuit<\/span><\/b><b><span data-font-family=\"Google Sans\">(<\/span><\/b><b><span data-font-family=\"Google Sans\">IC<\/span><\/b><b><span data-font-family=\"Google Sans\">)<\/span><\/b><\/a><b><span data-font-family=\"Google Sans\">, Exactly?<\/span><\/b><\/h2>\n<p><span data-font-family=\"Google Sans\">Every IC starts as a design schematic. This schematic describes how to arrange transistors, interconnects, and passive elements to perform a function. For example, the design might amplify a signal, store a bit, or execute an instruction. Next, engineers translate that design into a physical layout. A manufacturing facility then builds it onto a semiconductor wafer using a sequence of chemical and optical processes called fabrication.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">The defining trait of an IC is integration. Every component shares the same substrate. Layers built on that substrate stack up 30 or more times in a finished chip. Each layer is incredibly thin, measuring just a few millionths of a millimeter. Furthermore, designers determine whether a region becomes a transistor, resistor, or wire entirely by where they place n-type and p-type semiconductor regions across each layer.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">Consequently, engineers describe IC complexity using scale tiers. These categories include SSI, MSI, LSI, VLSI, and ULSI. They distinguish chips by transistor count and integration density rather than their specific function. For instance, a 1970s logic chip had only a few dozen transistors. In contrast, a modern applications processor contains tens of billions of transistors. Both are technically integrated circuits, but they sit at opposite ends of the scale.<\/span><\/p>\n<h2><b><span data-font-family=\"Google Sans\">How Are Integrated Circuits<\/span><\/b><b><span data-font-family=\"Google Sans\">(<\/span><\/b><b><span data-font-family=\"Google Sans\">ICs<\/span><\/b><b><span data-font-family=\"Google Sans\">) <\/span><\/b><b><span data-font-family=\"Google Sans\">Made? The Fabrication Process<\/span><\/b><\/h2>\n<p><span data-font-family=\"Google Sans\">IC fabrication happens in a semiconductor fab. This facility is incredibly sensitive to contamination. In fact, experts measure air cleanliness in particles per cubic foot. The manufacturing sequence generally follows several distinct stages.<\/span><\/p>\n<ol>\n<li>\n<h3><b><span data-font-family=\"Google Sans\"> Crystal Growth and Wafer Slicing<\/span><\/b><\/h3>\n<\/li>\n<\/ol>\n<p><span data-font-family=\"Google Sans\">First, manufacturers grow a single, ultra-pure silicon crystal. They typically use the Czochralski method for this step. In this process, operators melt electronic-grade silicon at around 1,500\u00b0C. This silicon is highly refined, containing less than one impurity per 100 billion atoms. The machine slowly pulls the molten silicon into a cylindrical ingot. Finally, a diamond saw slices the ingot into thin discs called wafers. The largest wafers today run 300mm in diameter, though the industry is evaluating a future move to 450mm.<\/span><\/p>\n<ol start=\"2\">\n<li>\n<h3><b><span data-font-family=\"Google Sans\"> Layering and Photolithography<\/span><\/b><\/h3>\n<\/li>\n<\/ol>\n<p><span data-font-family=\"Google Sans\">Next, the deposition stage begins. Workers deposit a layer of material across the wafer surface. This material is destined to become wiring, a transistor gate, or an insulator. Common deposition techniques include chemical vapor deposition (CVD) and physical vapor deposition (PVD).<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">After deposition, photolithography patterns the wafer. A machine projects the circuit pattern from a photomask onto a photoresist-coated wafer using light. This step defines exactly where the next processing action should occur. At advanced nodes, this step uses extreme ultraviolet (EUV) light with wavelengths around 13.5nm. As a result, it can resolve features measured in nanometers.<\/span><\/p>\n<ol start=\"3\">\n<li>\n<h3><b><span data-font-family=\"Google Sans\"> Etching, Doping, and Planarization<\/span><\/b><\/h3>\n<\/li>\n<\/ol>\n<p><span data-font-family=\"Google Sans\">Subsequently, etching removes unwanted material from the wafer. Chemicals handle wet etching, while plasma drives dry etching. This process carves out the exact pattern defined by the photoresist.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">Then, ion implantation embeds dopants into the wafer. These dopants create regions of increased or decreased conductivity. Specifically, they form the p-type and n-type silicon regions that build every transistor.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">To prepare for the next layer, chemical-mechanical planarization (CMP) polishes the wafer flat. This ensures the next layer can deposit accurately. Workers repeat these deposition, lithography, etching, and doping steps dozens of times to build the chip layer by layer.<\/span><\/p>\n<ol start=\"4\">\n<li>\n<h3><b><span data-font-family=\"Google Sans\"> Testing and Final Packaging<\/span><\/b><\/h3>\n<\/li>\n<\/ol>\n<p><span data-font-family=\"Google Sans\">Once the wafer is complete, automated equipment electrically tests every die. Testing machines mark bad dies so operators can separate them later. The ratio of good dies to total dies is called the wafer&#8217;s yield. Next, machines cut the good dies apart during a process called singulation. Finally, workers seal each good die into a protective package that connects it to the outside world.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">At advanced process nodes, this entire sequence requires significant time. For example, fabrication at modern 14\/10\/7nm-class nodes can take up to 15 weeks. Typically, the process lasts 11 to 13 weeks. Therefore, component sourcing and inventory planning matter just as much as the design itself. A quick design change to a part already in stock can save months of waiting.<\/span><\/p>\n<h2><b><span data-font-family=\"Google Sans\">How Does an IC Actually Work?<\/span><\/b><\/h2>\n<p><span data-font-family=\"Google Sans\">At the transistor level, an IC&#8217;s job is simple. It controls the flow of electrical current while using almost no current itself. The dominant technology for this is the MOSFET. Engineers arrange these switches in CMOS configurations. These configurations pair p-channel and n-channel transistors to switch states with very low power draw between transitions.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">Each transistor acts as a microscopic switch. If you combine enough switches, you create logic gates like AND, OR, NOT, and NAND. These gates further combine into adders, registers, and entire processor cores. Consequently, a modern CPU or GPU die is an incredibly large network of these switches. They clock in lockstep to execute instructions at gigahertz speeds.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">However, not every IC works this way. Analog ICs do not switch between discrete states. Instead, they manipulate continuous voltages and currents to amplify, filter, or condition a signal. Furthermore, mixed-signal ICs combine both jobs on the same die. This integration is exactly what makes a smartphone&#8217;s touchscreen controller or audio codec possible.<\/span><\/p>\n<h2><a href=\"https:\/\/www.lcsc.com\/category\/17.html\"><b><span data-font-family=\"Google Sans\">Types of Integrated Circuits<\/span><\/b><b><span data-font-family=\"Google Sans\">(<\/span><\/b><b><span data-font-family=\"Google Sans\">IC<\/span><\/b><b><span data-font-family=\"Google Sans\">) <\/span><\/b><\/a><\/h2>\n<p><span data-font-family=\"Google Sans\">Engineers classify ICs along a few overlapping dimensions. These include signal domain, function, and integration scale. Typically, the signal domain serves as the most common starting point. Integrated circuits are generally digital or analog, though mixed-signal ICs combine both circuit types on a single die.<\/span><\/p>\n<table style=\"height: 601px;\" width=\"1041\">\n<tbody>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">IC Category<\/span><\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">What It Does<\/span><\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">Typical Examples<\/span><\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">Common Applications<\/span><\/b><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">Digital<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Processes discrete binary signals (0s and 1s)<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Microprocessors, microcontrollers, FPGAs, logic gates, memory (DRAM, SRAM, flash)<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Computers, embedded controllers, digital logic<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">Analog<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Processes continuous signals through amplification, filtering, demodulation, and mixing<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Op-amps, voltage references, analog filters, power management ICs<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Sensor interfaces, power regulation, audio<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">Mixed-signal<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Combines analog and digital circuitry on one die, sometimes with embedded software<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">ADCs, DACs, CMOS image sensors, touch controllers<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Smartphone SoCs, cameras, touchscreens, radios<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">RF\/Communication<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Processes high-frequency signals for wireless links<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Low-noise amplifiers (LNAs), power amplifiers (PAs), mixers<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Cellular modems, Wi-Fi\/Bluetooth radios<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">Programmable logic<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Configurable logic blocks and interconnects that can be reprogrammed after manufacturing<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">FPGAs, CPLDs<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Prototyping, hardware acceleration, custom protocols<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><b><span data-font-family=\"Google Sans\">ASIC<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Custom-designed chips optimized for one specific application<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">Crypto-mining chips, AI accelerators<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"181.46666666666667\"><span data-font-family=\"Google Sans\">High-volume, performance-critical designs<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><b><span data-font-family=\"Google Sans\">Note:<\/span><\/b><span data-font-family=\"Google Sans\"> Within digital ICs, memory deserves special mention. DRAM, SRAM, and non-volatile flash memory are the dominant memory types. Standalone memory ICs remain common. However, designers increasingly embed memory functions directly into larger System-on-Chip (SoC) designs rather than shipping them as separate parts.<\/span><\/p>\n<h2><b><span data-font-family=\"Google Sans\">IC Packages: From Bare Die to <a href=\"https:\/\/blogs.lcsc.com\/blog\/electronic-components-for-pcb-assembly-reliable-supply-chain-solutions-with-lcsc\/\">PCB-Ready Component<\/a><\/span><\/b><\/h2>\n<p><span data-font-family=\"Google Sans\">The silicon die is only half the story. The package around it determines how the chip mounts to a board. It also affects how well it dissipates heat and behaves at high frequencies. Generally, IC packages fall into three broad families: through-hole packages, leaded surface-mount packages, and array packages.<\/span><\/p>\n<table style=\"height: 114px;\" width=\"1009\">\n<tbody>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">Package<\/span><\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">Mounting<\/span><\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">Pin Pitch<\/span><\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">Best For<\/span><\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">Trade-off<\/span><\/b><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">DIP<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Through-hole<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">0.1&#8243; (2.54mm)<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Prototyping, breadboards, hobbyist builds<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Large footprint, weak high-speed performance<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">SOIC<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Surface-mount<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">1.27mm (50 mil)<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">General-purpose analog\/digital ICs<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Limited pin count vs. QFN\/BGA<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">TSSOP<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Surface-mount<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Reduced pitch, ~1.0\u20131.2mm body<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Memory ICs, gate drivers, space-constrained boards<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Harder to hand-solder than SOIC<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">QFN<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Surface-mount, no leads<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">0.4\u20131.0mm<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Compact, thermally demanding, RF-sensitive designs<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Requires reflow; hard to hand-solder<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">BGA<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Array, solder balls<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Varies (0.4\u20131mm typical)<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">High pin-count processors, FPGAs, and DDR memory<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Requires X-ray inspection; difficult rework<\/span><\/td>\n<\/tr>\n<tr>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><b><span data-font-family=\"Google Sans\">WLCSP<\/span><\/b><\/p>\n<p><b>\u00a0<\/b><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Array, wafer-level<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Sub-mm<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Space-critical mobile and wearable designs<\/span><\/td>\n<td colspan=\"1\" rowspan=\"1\" width=\"148.93333333333334\"><span data-font-family=\"Google Sans\">Smallest size but lowest pin-count ceiling<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><span data-font-family=\"Google Sans\">Furthermore, package choice drives thermal and electrical performance. Through-hole DIP packages run 50\u2013100\u00b0C\/W in junction-to-ambient thermal resistance. Standard SOIC reaches 80\u2013120\u00b0C\/W. In contrast, a properly designed QFN drops to 15\u201340\u00b0C\/W. BGA packages achieve 10\u201330\u00b0C\/W, while flip-chip BGA variants drop under 10\u00b0C\/W using thermal balls. This difference matters significantly for any design pushing current through a small package.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">Therefore, follow this common rule of thumb for PCB design:<\/span><\/p>\n<ul>\n<li><b><span data-font-family=\"Google Sans\">DIP<\/span><\/b><span data-font-family=\"Google Sans\"> is easiest for hand soldering.<\/span><\/li>\n<li><b><span data-font-family=\"Google Sans\">SOIC<\/span><\/b><span data-font-family=\"Google Sans\"> is the most forgiving general-purpose SMT choice.<\/span><\/li>\n<li><b><span data-font-family=\"Google Sans\">QFN<\/span><\/b><span data-font-family=\"Google Sans\"> balances size and thermal performance best for compact designs.<\/span><\/li>\n<li><b><span data-font-family=\"Google Sans\">BGA<\/span><\/b><span data-font-family=\"Google Sans\"> is the right call when pin count and high-speed performance matter most.<\/span><\/li>\n<\/ul>\n<h2><b><span data-font-family=\"Google Sans\">Why Moore&#8217;s Law Looks Different in 2026<\/span><\/b><\/h2>\n<p><span data-font-family=\"Google Sans\">For decades, IC progress meant shrinking the transistor to fit more of them on a die. That trend is still alive, but its character has changed. For instance, TSMC confirmed that its N2 (2nm) process entered volume production in the fourth quarter of 2025. This milestone marks the industry&#8217;s shift from FinFET transistor architecture to Nanosheet Gate-All-Around (GAA) technology. In this design, the gate surrounds the channel on all four sides. Consequently, it provides tighter electrostatic control and reduces leakage.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">However, the economics of that progress are shifting too. Industry roadmaps through the rest of the decade increasingly use angstrom-based naming instead of nanometers. Furthermore, analysts note that the density gain between consecutive generations has narrowed significantly. It no longer matches the doubling that Moore&#8217;s Law once implied. As a direct response, leading-edge chipmakers are increasingly assembling multiple dies into a single advanced package. This practice is known as chiplet design or heterogeneous integration.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">For component buyers and PCB designers, the practical takeaway focuses on availability and cost. Reports indicate that TSMC&#8217;s 2nm process costs at least 50% more than the 3nm node. This high cost filters down through allocation, lead times, and pricing. Therefore, mature nodes (28nm and above) remain the practical, cost-effective choice for most boards. That is exactly where manufacturers continue to produce the bulk of catalog ICs, including microcontrollers and op-amps.<\/span><\/p>\n<h2><b><span data-font-family=\"Google Sans\"><a href=\"https:\/\/www.lcsc.com\/category\/17.html\">Choosing the Right IC<\/a> for Your Design<\/span><\/b><\/h2>\n<p><span data-font-family=\"Google Sans\">Component selection comes down to a short list of practical questions:<\/span><\/p>\n<ol>\n<li><b><span data-font-family=\"Google Sans\">What signal domain does the function need?<\/span><\/b><span data-font-family=\"Google Sans\"> Pure logic points to digital. Sensor conditioning points to analog. Meanwhile, anything involving conversion points to mixed-signal.<\/span><\/li>\n<li><b><span data-font-family=\"Google Sans\">What is the production volume?<\/span><\/b><span data-font-family=\"Google Sans\"> Low-volume prototyping favors hand-solderable packages like DIP or SOIC. Conversely, high-volume designs favor QFN or BGA because they save space.<\/span><\/li>\n<li><b><span data-font-family=\"Google Sans\">What is the thermal budget?<\/span><\/b><span data-font-family=\"Google Sans\"> A power IC running near its current limit benefits from a QFN or BGA package. These packages provide an exposed thermal pad.<\/span><\/li>\n<li><b><span data-font-family=\"Google Sans\">Is the part likely to face allocation risk?<\/span><\/b><span data-font-family=\"Google Sans\"> Components built on leading-edge nodes carry more supply risk. Therefore, parts built on mature nodes with multiple qualified manufacturers offer safer alternatives.<\/span><\/li>\n<\/ol>\n<p><span data-font-family=\"Google Sans\">Fortunately, sourcing platforms like LCSC help narrow your part list. They stock a broad catalog of ICs with full datasheet access and stock visibility. Furthermore, they integrate directly with JLCPCB to help designs move smoothly from BOM to assembled board.<\/span><\/p>\n<h2><b><span data-font-family=\"Google Sans\">FAQ: Integrated Circuit(<\/span><\/b><b><span data-font-family=\"Google Sans\">IC<\/span><\/b><b><span data-font-family=\"Google Sans\">) Basics<\/span><\/b><\/h2>\n<h3><b><span data-font-family=\"Google Sans\">Q<\/span><\/b><b><span data-font-family=\"Google Sans\">: <\/span><\/b><b><span data-font-family=\"Google Sans\">What is the difference between a chip and an integrated circuit?<\/span><\/b><\/h3>\n<p><span data-font-family=\"Google Sans\">They are generally the same thing. &#8220;Chip&#8221; is the colloquial term, while &#8220;integrated circuit&#8221; is the formal one. Both refer to a complete electronic circuit fabricated together on a single piece of semiconductor material. The term &#8220;chip&#8221; applies equally to a simple logic device and a modern processor. In everyday engineering conversation, professionals use the two terms interchangeably without any technical distinction.<\/span><\/p>\n<h3><b><span data-font-family=\"Google Sans\">Q<\/span><\/b><b><span data-font-family=\"Google Sans\">: <\/span><\/b><b><span data-font-family=\"Google Sans\">What material are most ICs made from?<\/span><\/b><\/h3>\n<p><span data-font-family=\"Google Sans\">Silicon dominates the industry due to its natural abundance and stable oxide layer. This layer makes insulating and patterning the surface much easier. Furthermore, decades of well-understood doping behavior support this choice. Specialized applications sometimes use gallium arsenide for better electron mobility. However, silicon&#8217;s combination of low cost and supply chain maturity ensures it dominates mainstream IC production.<\/span><\/p>\n<h3><b><span data-font-family=\"Google Sans\">Q<\/span><\/b><b><span data-font-family=\"Google Sans\">: <\/span><\/b><b><span data-font-family=\"Google Sans\">Why are modern ICs measured in nanometers or angstroms?<\/span><\/b><\/h3>\n<p><span data-font-family=\"Google Sans\">The figure refers to a process node. Historically, this tracked the physical size of a transistor&#8217;s smallest feature, like the gate length. Today, node names have less direct relation to actual transistor dimensions. Instead, manufacturers treat them as marketing labels that summarize a bundle of performance improvements. Nevertheless, smaller node numbers still correlate with higher transistor density and improved efficiency.<\/span><\/p>\n<h3><b><span data-font-family=\"Google Sans\">Q<\/span><\/b><b><span data-font-family=\"Google Sans\">: <\/span><\/b><b><span data-font-family=\"Google Sans\">Can an IC be repaired if it fails?<\/span><\/b><\/h3>\n<p><span data-font-family=\"Google Sans\">No, you cannot repair an IC. Unlike discrete circuits, an IC is a single sealed unit fabricated as one inseparable piece of silicon. If any internal transistor fails due to electrical overstress, you cannot access it. Therefore, you must replace the entire chip. Because of this, manufacturers invest heavily in wafer probing to catch defective dies early.<\/span><\/p>\n<h3><b><span data-font-family=\"Google Sans\">Q<\/span><\/b><b><span data-font-family=\"Google Sans\">: <\/span><\/b><b><span data-font-family=\"Google Sans\">What is the difference between an ASIC and an FPGA?<\/span><\/b><\/h3>\n<p><span data-font-family=\"Google Sans\">An ASIC is custom-designed to perform one specific function. Its logic is permanently set in silicon during manufacturing. Conversely, an FPGA contains an array of configurable logic blocks. Engineers can reprogram these blocks repeatedly after manufacturing using hardware description languages. This flexibility makes FPGAs excellent for prototyping. However, ASICs win on raw performance and lower per-unit cost at high volumes.<\/span><\/p>\n<h2><b><span data-font-family=\"Google Sans\">C<\/span><\/b><b><span data-font-family=\"Google Sans\">onclusion<\/span><\/b><\/h2>\n<p><span data-font-family=\"Google Sans\">An integrated circuit takes the physics of a microscopic switch and replicates it billions of times across a few square millimeters of silicon. The core fabrication concepts have not changed fundamentally since the 1960s, even as precision has reached atomic scales. Whether you are specifying an op-amp or evaluating a BGA-packaged SoC, understanding the fabrication process helps you predict thermal behavior, sourcing risk, and assembly costs.<\/span><\/p>\n<p><span data-font-family=\"Google Sans\">Therefore, you should explore comprehensive component catalogs to compare specs and check stock before finalizing your next BOM.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>An integrated circuit (IC) is a complete electronic circuit. It integrates transistors, resistors, capacitors, and wiring onto a single piece of semiconductor material, usually silicon. Today, a modern IC packs millions or billions of transistors onto a chip just a few millimeters wide. Consequently, it can switch signals billions of times per second to perform [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"categories":[27],"tags":[289,220,221],"class_list":["post-4334","post","type-post","status-publish","format-standard","hentry","category-electronic-components","tag-electronic-components","tag-ic","tag-integrated-circuits"],"blocksy_meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>IC Basics Explained: How Do Integrated Circuits Work? - LCSC<\/title>\n<meta name=\"description\" content=\"Learn how integrated circuits are made and work, from silicon fabrication to CMOS transistors and modern IC packaging types.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"IC Basics Explained: How Do Integrated Circuits Work? - LCSC\" \/>\n<meta property=\"og:description\" content=\"Learn how integrated circuits are made and work, from silicon fabrication to CMOS transistors and modern IC packaging types.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/\" \/>\n<meta property=\"og:site_name\" content=\"Blog | LCSC Electronics\" \/>\n<meta property=\"article:published_time\" content=\"2026-06-30T07:13:05+00:00\" \/>\n<meta name=\"author\" content=\"LCSC Editor\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"LCSC Editor\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"11 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/\"},\"author\":{\"name\":\"LCSC Editor\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#\\\/schema\\\/person\\\/11d3b92d0208775e62d7f79a0da4e781\"},\"headline\":\"IC Basics Explained: How Do Integrated Circuits Work?\",\"datePublished\":\"2026-06-30T07:13:05+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/\"},\"wordCount\":2410,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#organization\"},\"keywords\":[\"Electronic Components\",\"IC\",\"Integrated Circuits\"],\"articleSection\":[\"Electronic Components\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/\",\"url\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/\",\"name\":\"IC Basics Explained: How Do Integrated Circuits Work? - LCSC\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#website\"},\"datePublished\":\"2026-06-30T07:13:05+00:00\",\"description\":\"Learn how integrated circuits are made and work, from silicon fabrication to CMOS transistors and modern IC packaging types.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/ic-basics-explained-how-do-integrated-circuits-work\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"IC Basics Explained: How Do Integrated Circuits Work?\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#website\",\"url\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/\",\"name\":\"Blog | LCSC Electronics\",\"description\":\"LCSC Electronics Blogs and News\",\"publisher\":{\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#organization\",\"name\":\"Blog | LCSC Electronics\",\"url\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/blogs.lcsc.com\\\/wp-content\\\/uploads\\\/2023\\\/10\\\/logo.png\",\"contentUrl\":\"https:\\\/\\\/blogs.lcsc.com\\\/wp-content\\\/uploads\\\/2023\\\/10\\\/logo.png\",\"width\":939,\"height\":180,\"caption\":\"Blog | LCSC Electronics\"},\"image\":{\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/#\\\/schema\\\/person\\\/11d3b92d0208775e62d7f79a0da4e781\",\"name\":\"LCSC Editor\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/0c5d2ddc240c300192ecdc04c2d2f7914d4b02bd00ea81b32e98b698c49e357f?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/0c5d2ddc240c300192ecdc04c2d2f7914d4b02bd00ea81b32e98b698c49e357f?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/0c5d2ddc240c300192ecdc04c2d2f7914d4b02bd00ea81b32e98b698c49e357f?s=96&d=mm&r=g\",\"caption\":\"LCSC Editor\"},\"url\":\"https:\\\/\\\/blogs.lcsc.com\\\/blog\\\/author\\\/lcsc-editor\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"IC Basics Explained: How Do Integrated Circuits Work? - LCSC","description":"Learn how integrated circuits are made and work, from silicon fabrication to CMOS transistors and modern IC packaging types.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/","og_locale":"en_US","og_type":"article","og_title":"IC Basics Explained: How Do Integrated Circuits Work? - LCSC","og_description":"Learn how integrated circuits are made and work, from silicon fabrication to CMOS transistors and modern IC packaging types.","og_url":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/","og_site_name":"Blog | LCSC Electronics","article_published_time":"2026-06-30T07:13:05+00:00","author":"LCSC Editor","twitter_card":"summary_large_image","twitter_misc":{"Written by":"LCSC Editor","Est. reading time":"11 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/#article","isPartOf":{"@id":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/"},"author":{"name":"LCSC Editor","@id":"https:\/\/blogs.lcsc.com\/blog\/#\/schema\/person\/11d3b92d0208775e62d7f79a0da4e781"},"headline":"IC Basics Explained: How Do Integrated Circuits Work?","datePublished":"2026-06-30T07:13:05+00:00","mainEntityOfPage":{"@id":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/"},"wordCount":2410,"commentCount":0,"publisher":{"@id":"https:\/\/blogs.lcsc.com\/blog\/#organization"},"keywords":["Electronic Components","IC","Integrated Circuits"],"articleSection":["Electronic Components"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/","url":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/","name":"IC Basics Explained: How Do Integrated Circuits Work? - LCSC","isPartOf":{"@id":"https:\/\/blogs.lcsc.com\/blog\/#website"},"datePublished":"2026-06-30T07:13:05+00:00","description":"Learn how integrated circuits are made and work, from silicon fabrication to CMOS transistors and modern IC packaging types.","breadcrumb":{"@id":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/blogs.lcsc.com\/blog\/ic-basics-explained-how-do-integrated-circuits-work\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/blogs.lcsc.com\/blog\/"},{"@type":"ListItem","position":2,"name":"IC Basics Explained: How Do Integrated Circuits Work?"}]},{"@type":"WebSite","@id":"https:\/\/blogs.lcsc.com\/blog\/#website","url":"https:\/\/blogs.lcsc.com\/blog\/","name":"Blog | LCSC Electronics","description":"LCSC Electronics Blogs and News","publisher":{"@id":"https:\/\/blogs.lcsc.com\/blog\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/blogs.lcsc.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/blogs.lcsc.com\/blog\/#organization","name":"Blog | LCSC Electronics","url":"https:\/\/blogs.lcsc.com\/blog\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/blogs.lcsc.com\/blog\/#\/schema\/logo\/image\/","url":"https:\/\/blogs.lcsc.com\/wp-content\/uploads\/2023\/10\/logo.png","contentUrl":"https:\/\/blogs.lcsc.com\/wp-content\/uploads\/2023\/10\/logo.png","width":939,"height":180,"caption":"Blog | LCSC Electronics"},"image":{"@id":"https:\/\/blogs.lcsc.com\/blog\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/blogs.lcsc.com\/blog\/#\/schema\/person\/11d3b92d0208775e62d7f79a0da4e781","name":"LCSC Editor","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/0c5d2ddc240c300192ecdc04c2d2f7914d4b02bd00ea81b32e98b698c49e357f?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/0c5d2ddc240c300192ecdc04c2d2f7914d4b02bd00ea81b32e98b698c49e357f?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/0c5d2ddc240c300192ecdc04c2d2f7914d4b02bd00ea81b32e98b698c49e357f?s=96&d=mm&r=g","caption":"LCSC Editor"},"url":"https:\/\/blogs.lcsc.com\/blog\/author\/lcsc-editor\/"}]}},"_links":{"self":[{"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/posts\/4334","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/comments?post=4334"}],"version-history":[{"count":1,"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/posts\/4334\/revisions"}],"predecessor-version":[{"id":4337,"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/posts\/4334\/revisions\/4337"}],"wp:attachment":[{"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/media?parent=4334"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/categories?post=4334"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.lcsc.com\/blog\/wp-json\/wp\/v2\/tags?post=4334"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}